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公开(公告)号：US20230027892A1
公开(公告)日：2023-01-26
申请号：US17864774
申请日：2022-07-14
Inventor： KWANG-SEONG CHOI , Yong-Sung EOM , Jiho JOO , GWANG-MUN CHOI , Seok-Hwan MOON , Ho-Gyeong YUN , CHANMI LEE , Ki-Seok JANG
IPC: H01L33/62 , H01L25/075 , H01L33/00
Abstract: Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
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公开(公告)号：US20220077099A1
公开(公告)日：2022-03-10
申请号：US17467557
申请日：2021-09-07
Inventor： Gwang-Mun CHOI , Yong-Sung EOM , Kwang-Seong CHOI , Jiho JOO , Ki-Seok JANG , Chanmi LEE
Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5≤(b+c)/a≤1.5, a>0, b≥0, c>0 [Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.
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