-
公开(公告)号：US20190067235A1
公开(公告)日：2019-02-28
申请号：US16115060
申请日：2018-08-28
Inventor： Kwang-Seong CHOI , Yong-Sung Eom , Keon-Soo Jang , Seok Hwan Moon , Hyun-Cheol Bae , leeseul Jeong , Wagno Alves Braganca Junior
Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
-
公开(公告)号：US20220102603A1
公开(公告)日：2022-03-31
申请号：US17399754
申请日：2021-08-11
Inventor： Kwang-Seong CHOI , Yong Sung EOM , Jiho JOO , Gwang-Mun CHOI , Seok-Hwan MOON , Chanmi LEE , Ki Seok JANG
Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
-
公开(公告)号：US20220077099A1
公开(公告)日：2022-03-10
申请号：US17467557
申请日：2021-09-07
Inventor： Gwang-Mun CHOI , Yong-Sung EOM , Kwang-Seong CHOI , Jiho JOO , Ki-Seok JANG , Chanmi LEE
Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5≤(b+c)/a≤1.5, a>0, b≥0, c>0 [Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.
-
4.发明申请公开(公告)号：US20210358885A1
公开(公告)日：2021-11-18
申请号：US17387800
申请日：2021-07-28
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
-
5.发明申请公开(公告)号：US20150237739A1
公开(公告)日：2015-08-20
申请号：US14704597
申请日：2015-05-05
Inventor： Yong Sung EOM , Kwang-Seong CHOI , Hyun-cheol BAE , Jung Hyun NOH , Jong Tae MOON
CPC classification number: H05K3/1216 , C25D5/02 , H01B1/02 , H01B1/22 , H05K1/09 , H05K1/095 , H05K3/102 , H05K3/188 , H05K3/246 , H05K2201/0245 , H05K2201/0302 , H05K2203/0425
Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.
Abstract translation: 本发明涉及用于形成导电电路图案的图案形成组合物。 图案形成组合物包括Cu粉末，用于电耦合Cu粉末的焊料，聚合物树脂，固化剂和还原剂。 根据本发明，可以以低成本形成具有优良导电性的电路图案。
-
Patent Agency Ranking
公开(公告)号：US20220384674A1
公开(公告)日：2022-12-01
申请号：US17828701
申请日：2022-05-31
Inventor： Jiho JOO , Yong Sung EOM , Kwang-Seong CHOI , Chanmi LEE , Gwang-Mun CHOI , Ki Seok JANG , Seok-Hwan MOON , Ho-Gyeong YUN
Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
-
7.发明申请公开(公告)号：US20190211231A1
公开(公告)日：2019-07-11
申请号：US16221206
申请日：2018-12-14
Inventor： KeonSoo JANG , Yong Sung EOM , Kwang-Seong CHOI , Seok-Hwan MOON , Hyun-cheol BAE
IPC: C09J7/30 , C09J167/02 , H01L21/02
CPC classification number: C09J7/30 , C08G77/16 , C08K3/346 , C08K3/36 , C08K2003/0812 , C08K2003/2237 , C08K2003/2296 , C08K2003/3045 , C09J167/02 , H01L21/02304
Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
-
公开(公告)号：US20170141071A1
公开(公告)日：2017-05-18
申请号：US14958341
申请日：2015-12-03
Inventor： Kwang-Seong CHOI , Hyun-cheol BAE , Yong Sung EOM , Jin Ho LEE , Haksun LEE
CPC classification number: H01L24/81 , H01L21/4853 , H01L21/563 , H01L25/50 , H01L2224/0401 , H01L2224/05568 , H01L2224/0557 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13144 , H01L2224/16145 , H01L2224/16237 , H01L2224/73104 , H01L2224/73204 , H01L2224/81001 , H01L2224/81002 , H01L2224/81091 , H01L2224/81143 , H01L2224/81208 , H01L2224/81224 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/81911 , H01L2224/83224 , H01L2224/83862 , H01L2224/9211 , H01L2224/95 , H01L2924/00014 , H01L2924/014 , H01L2924/01083 , H01L2924/0105 , H01L2924/01049 , H01L2224/81 , H01L2224/83 , H01L2924/01047 , H01L2924/01029
Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.
-
9.发明申请MEASURING DEVICE AND METHOD OF MEASURING SIGNAL TRANSMISSION TIME DIFFERENCE THEREOF 有权测量装置及其测量信号传输时间差异的方法公开(公告)号：US20140205280A1
公开(公告)日：2014-07-24
申请号：US13934589
申请日：2013-07-03
Inventor： Joong-Seon CHOE , Chun Ju YOUN , Jong-Hoi KIM , Duk Jun KIM , Yong-Hwan KWON , Kwang-Seong CHOI , Eun Soo NAM
IPC: H04B10/07
CPC classification number: H04B10/0779
Abstract: Provided is a method of measuring signal transmission time difference of a measuring device. The measuring device according to embodiments, by measuring a skew on two optical paths through signal delays of sufficient sizes for skew measurement on the optical paths, even a skew having a minute size can be measured within a measureable range.
Abstract translation: 提供了测量装置的信号传输时间差的测量方法。 根据实施例的测量装置可以在可测量的范围内测量通过在光路上经过足够尺寸的信号延迟的两个光路上的偏斜，甚至具有微小尺寸的偏斜。
-
公开(公告)号：US20200075535A1
公开(公告)日：2020-03-05
申请号：US16555060
申请日：2019-08-29
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.017 seconds)
