公开(公告)号：US20170330816A1

公开(公告)日：2017-11-16

申请号：US15531900

申请日：2015-11-23

Applicant: Element Six Technologies Limited

Inventor： Julian ANAYA CALVO ,  Martin Hermann Hans KUBALL ,  Julian James Sargood ELLIS ,  Daniel James TWITCHEN

IPC: H01L23/373 ,  C09K5/14 ,  H01L23/498

CPC classification number: H01L23/3732 ,  C04B37/006 ,  C04B2235/722 ,  C04B2235/9607 ,  C04B2235/963 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/363 ,  C04B2237/708 ,  C04B2237/72 ,  C09K5/14 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device comprising: a semiconductor component; a diamond heat spreader; and a metal bond, wherein the semiconductor component is bonded to the diamond heat spreader via the metal bond, wherein the metal bond comprises a layer of chromium bonded to the diamond heat spreader and a further metal layer disposed between the layer of chromium and the semiconductor component, and wherein the semiconductor component is configured to operate at an areal power density of at least 1 kW/cm2 and/or a linear power density of at least 1 W/mm.