公开(公告)号：US09035368B2

公开(公告)日：2015-05-19

申请号：US13767193

申请日：2013-02-14

Applicant: Elpida Memory, Inc.

Inventor： Kazuma Shimamoto

IPC: H01L23/535 ,  H01L27/108

CPC classification number: H01L27/10814 ,  H01L23/535 ,  H01L27/10823 ,  H01L27/10855 ,  H01L27/10876 ,  H01L27/10885 ,  H01L27/10891 ,  H01L29/16 ,  H01L29/7827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a semiconductor device including first and second semiconductor pillars formed on a surface of a semiconductor substrate and aligning in a first direction; a first interconnect extending in a second direction intersecting with the first direction and provided between the first and second semiconductor pillars; and a first contact pad located over the first interconnect, the first contact pad being in contact with and electrically connected to the first semiconductor pillar at a side surface thereof, while being electrically isolated from the second semiconductor pillar.

Abstract translation: 提供一种半导体器件，包括形成在半导体衬底的表面上并在第一方向上对准的第一和第二半导体柱; 第一互连件，沿与第一方向交叉的第二方向延伸并设置在第一和第二半导体柱之间; 以及位于所述第一互连件上方的第一接触焊盘，所述第一接触焊盘在与所述第二半导体柱电隔离的同时与所述第一半导体柱的侧表面接触并电连接。