公开(公告)号：US09278854B2

公开(公告)日：2016-03-08

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  B81C99/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。

公开(公告)号：US20150056725A1

公开(公告)日：2015-02-26

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。