利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.021 秒)

    Disk drive that refreshes data on portions of a disk based on a number of write operations thereto
    1.
    发明授权
    Disk drive that refreshes data on portions of a disk based on a number of write operations thereto 有权
    磁盘驱动器，其基于对其的写入操作的数量来刷新磁盘的部分上的数据

    公开(公告)号：US07345837B1

    公开(公告)日：2008-03-18

    申请号：US11184273

    申请日：2005-07-19

    申请人： Erhard Schreck ,  Donald Brunnett ,  Hung V. Nguyen ,  Bruce Schardt ,  Andrew Vogan

    发明人： Erhard Schreck ,  Donald Brunnett ,  Hung V. Nguyen ,  Bruce Schardt ,  Andrew Vogan

    IPC分类号： G11B27/36 ,  G11B5/09

    CPC分类号： G11B5/09

    摘要： A disk drive includes a rotatable data storage disk, a transducer, an actuator, and a controller. The transducer is configured to read and write data on the disk. The actuator is configured to position the transducer relative to defined portions of the disk. The controller is configured to determine how many times data has been written to the defined portions of the disk. The controller is also configured to refresh data residing at a particular one of the defined portions of the disk when the number of times data has been written to the particular defined portion of the disk satisfies a threshold value.

    摘要翻译： 磁盘驱动器包括可旋转数据存储盘，换能器，致动器和控制器。 传感器配置为在磁盘上读取和写入数据。 致动器被配置成相对于盘的限定部分定位换能器。 控制器被配置为确定数据被写入磁盘的定义部分的次数。 当数据已被写入盘的特定定义部分的次数满足阈值时，控制器还被配置为刷新驻留在盘的特定一个定义部分的数据。

    Process for texturing brittle glass disks
    5.
    发明授权
    Process for texturing brittle glass disks 失效
    脆性玻璃盘纹理处理

    公开(公告)号：US5595791A

    公开(公告)日：1997-01-21

    申请号：US455171

    申请日：1995-05-31

    申请人： Peter M. Baumgart ,  Wing P. Leung ,  Hung V. Nguyen ,  Thao A. Nguyen ,  Andrew C. Tam ,  Anthony Wu

    发明人： Peter M. Baumgart ,  Wing P. Leung ,  Hung V. Nguyen ,  Thao A. Nguyen ,  Andrew C. Tam ,  Anthony Wu

    IPC分类号： B23K26/00 ,  C03C23/00 ,  G11B5/73 ,  G11B5/82 ,  G11B5/84 ,  B05D1/36

    CPC分类号： G11B5/8408 ,  B23K26/0084 ,  B23K26/40 ,  C03C23/0025 ,  G11B5/8404 ,  B23K2203/16 ,  B23K2203/52

    摘要： A process for creating an array of bumps to texture a brittle nonmetallic surface, such as a glass substrate for data recording disks. The texturing process uses a laser to provide pulses of proper energy fluence to the brittle glass surface to produce a plurality of raised bumps in the surface. The bump creation is accomplished without unwanted micro-cracking or ejection of surface material by limiting the laser pulse fluence to a value in a narrow operating region discovered below the abrupt thermal shock fluence threshold for the brittle nonmetallic surface material. The process is also applicable to other brittle surface textures, such as those intended for use as "stamping surfaces" for the contact reproduction of the negative of a surface pattern, such as an optical disk.

    摘要翻译： 用于产生凸起阵列以构造脆性非金属表面的方法，例如用于数据记录盘的玻璃基板。 纹理化处理使用激光器向脆性玻璃表面提供适当能量注量的脉冲，以在表面上产生多个凸起的凸起。 通过将激光脉冲流量限制在低于脆性非金属表面材料的突然热冲击注量阈值以下发现的窄操作区域中的值，实现了凸起的产生，而不会发生表面材料的不必要的微裂纹或喷射。 该方法也适用于其它脆性表面纹理，例如那些旨在用作表面图案（例如光盘）的负面的接触再现的“冲压表面”的那些。

    Process for texturing brittle nonmetallic surfaces
    6.
    发明授权
    Process for texturing brittle nonmetallic surfaces 失效
    脆性非金属表面纹理处理

    公开(公告)号：US5567484A

    公开(公告)日：1996-10-22

    申请号：US455861

    申请日：1995-05-31

    申请人： Peter M. Baumgart ,  Wing P. Leung ,  Hung V. Nguyen ,  Thao A. Nguyen ,  Andrew C. Tam ,  Anthony Wu

    发明人： Peter M. Baumgart ,  Wing P. Leung ,  Hung V. Nguyen ,  Thao A. Nguyen ,  Andrew C. Tam ,  Anthony Wu

    IPC分类号： B23K26/00 ,  C03C23/00 ,  G11B5/73 ,  G11B5/82 ,  G11B5/84 ,  B05D3/00

    CPC分类号： G11B5/8408 ,  B23K26/0084 ,  B23K26/40 ,  C03C23/0025 ,  G11B5/8404 ,  B23K2203/16 ,  B23K2203/52

    摘要： A process for creating an array of bumps to texture a brittle nonmetallic surface, such as a glass substrate for data recording disks. The texturing process uses a laser to provide pulses of proper energy fluence to the brittle glass surface to produce a plurality of raised bumps in the surface. The bump creation is accomplished without unwanted micro-cracking or ejection of surface material by limiting the laser pulse fluence to a value in a narrow operating region discovered below the abrupt thermal shock fluence threshold for the brittle nonmetallic surface material. The process is also applicable to other brittle surface textures, such as those intended for use as "stamping surfaces" for the contact reproduction of the negative of a surface pattern, such as an optical disk.

    摘要翻译： 用于产生凸起阵列以构造脆性非金属表面的方法，例如用于数据记录盘的玻璃基板。 纹理化处理使用激光器向脆性玻璃表面提供适当能量注量的脉冲，以在表面上产生多个凸起的凸起。 通过将激光脉冲流量限制在低于脆性非金属表面材料的突然热冲击注量阈值以下发现的窄操作区域中的值，实现了凸起的产生，而不会发生表面材料的不必要的微裂纹或喷射。 该方法也适用于其它脆性表面纹理，例如那些旨在用作表面图案（例如光盘）的负面的接触再现的“冲压表面”的那些。

    Optical subassembly grounding in an optoelectronic module
    7.
    发明授权
    Optical subassembly grounding in an optoelectronic module 有权
    光电子组件中的光子组件接地

    公开(公告)号：US08267599B2

    公开(公告)日：2012-09-18

    申请号：US12575186

    申请日：2009-10-07

    申请人： Hung V. Nguyen ,  Yongshan Zhang ,  Joshua Moore

    发明人： Hung V. Nguyen ,  Yongshan Zhang ,  Joshua Moore

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4246 ,  G02B6/4201 ,  G02B6/4255 ,  G02B6/4267 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4284

    摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

    摘要翻译： 光电子组件中的光子组件接地。 在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。 顶部垫圈包括顶部壳体表面和顶部OSA表面。 顶壳表面被配置为与光电模块的导电顶壳直接物理接触。 顶部OSA表面被配置为与OSA的导电外壳直接物理接触。 底部垫圈包括底部OSA表面和底部壳体表面。 底部OSA表面被配置为与OSA的导电外壳直接物理接触。 底壳表面被配置成与光电子模块的导电底壳直接物理接触。

    OPTICAL SUBASSEMBLY GROUNDING IN AN OPTOELECTRONIC MODULE
    8.
    发明申请
    OPTICAL SUBASSEMBLY GROUNDING IN AN OPTOELECTRONIC MODULE 有权
    光电子模块中的光学接收

    公开(公告)号：US20110081120A1

    公开(公告)日：2011-04-07

    申请号：US12575186

    申请日：2009-10-07

    申请人： Hung V. Nguyen ,  Yongshan Zhang ,  Joshua Moore

    发明人： Hung V. Nguyen ,  Yongshan Zhang ,  Joshua Moore

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4246 ,  G02B6/4201 ,  G02B6/4255 ,  G02B6/4267 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4284

    摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

    摘要翻译： 光电子组件中的光子组件接地。 在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。 顶部垫圈包括顶部壳体表面和顶部OSA表面。 顶壳表面被配置为与光电模块的导电顶壳直接物理接触。 顶部OSA表面被配置为与OSA的导电外壳直接物理接触。 底部垫圈包括底部OSA表面和底部壳体表面。 底部OSA表面被配置为与OSA的导电外壳直接物理接触。 底壳表面被配置成与光电子模块的导电底壳直接物理接触。