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122 条记录 (耗时 0.017 秒)

    Process for engraving ceramic surfaces using local laser vitrification
    5.
    发明授权
    Process for engraving ceramic surfaces using local laser vitrification 失效
    使用局部激光玻璃化法雕刻陶瓷表面的工艺

    公开(公告)号：US5554335A

    公开(公告)日：1996-09-10

    申请号：US392046

    申请日：1995-02-22

    申请人： William C. Fields ,  Dan Fredrick ,  Steve Grannemann ,  Phyllis Hannan ,  Igor Lukashevsky

    发明人： William C. Fields ,  Dan Fredrick ,  Steve Grannemann ,  Phyllis Hannan ,  Igor Lukashevsky

    IPC分类号： B23K26/16 ,  B23K26/40 ,  B41M1/34 ,  B41M5/24 ,  B44C1/22 ,  C04B41/00 ,  C04B41/80

    CPC分类号： C04B41/009 ,  B23K26/16 ,  B23K26/40 ,  B41M1/34 ,  B41M5/24 ,  B44C1/228 ,  C04B41/0036 ,  C04B41/80 ,  B23K2203/52

    摘要： A process is provided for producing contrasting, long lasting, glassy heat fused images on the surface of ceramic materials such as bricks using a laser to vitrify the substrate material. The process is accomplished in three stages: Stage 1) the laser produces a non-adherent, highly light absorptive layer by heating and removing material from the marking field to create depth into the brick's surface; Stage 2) melting of the main portion of the substrate material along the marking field using the non-adherent light absorptive layer from Stage 1 as an effective light absorber/heat transducer to cause vitrification along the marking field; Stage 3) residue from the melting in stage 2 is removed by laser ablation to produce the vitrified finished mark.

    摘要翻译： 提供了一种用于在诸如使用激光玻璃化基底材料的砖的陶瓷材料的表面上产生对比，持久的玻璃状热熔融图像的方法。 该过程分三个阶段完成：阶段1）激光通过从标记场加热和去除材料以产生砖表面的深度产生非粘附的高光吸收层; 阶段2）使用来自阶段1的非粘附光吸收层作为有效的光吸收器/热传感器沿着标记场熔化基底材料的主要部分，以沿着标记场引起玻璃化; 阶段3）通过激光烧蚀去除阶段2中熔化的残余物以产生玻璃化成品标记。

    Method of separation of pieces from super hard material by partial laser cut and pressure cleavage
    7.
    发明授权
    Method of separation of pieces from super hard material by partial laser cut and pressure cleavage 失效
    通过部分激光切割和压力切割从超硬材料分离碎片的方法

    公开(公告)号：US5387776A

    公开(公告)日：1995-02-07

    申请号：US60459

    申请日：1993-05-11

    申请人： Tatyana L. Preiser

    发明人： Tatyana L. Preiser

    IPC分类号： B23K26/00 ,  B23K26/40 ,  B26F3/00 ,  B26F3/04 ,  B28D5/00 ,  C30B29/04 ,  H01L23/373

    CPC分类号： B28D5/0011 ,  B23K26/40 ,  B23K26/402 ,  B23K2203/30 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2924/0002

    摘要： This invention relates to a method of separating at least one piece from a super hard material plate having top and bottom surfaces, comprising providing a laser capable of cutting said super hard material plate; making a cut with said laser through the top surface of said plate, said cut defining the shape of the piece to be separated and being to a depth which is less than the overall thickness of said plate; and separating said piece from said plate by applying an effective amount of pressure to said plate along the line of said cut to separate the uncut portion of said plate adjacent said cut.

    摘要翻译： 本发明涉及一种从具有顶表面和底表面的超硬材料板分离至少一件的方法，包括提供能够切割所述超硬材料板的激光; 用所述激光穿过所述板的顶表面进行切割，所述切口限定待分离的件的形状，并且其深度小于所述板的总厚度; 以及通过沿着所述切割线向所述板施加有效量的压力以将所述板与所述板分离，以将所述板的未切割部分分隔开邻近所述切口。

    Method for forming an integrated circuit package with via interconnection
    8.
    发明授权
    Method for forming an integrated circuit package with via interconnection 失效
    用于形成具有通孔互连的集成电路封装的方法

    公开(公告)号：US5378869A

    公开(公告)日：1995-01-03

    申请号：US37209

    申请日：1993-03-26

    申请人： Robert C. Marrs ,  Tadashi Hirakawa

    发明人： Robert C. Marrs ,  Tadashi Hirakawa

    IPC分类号： H01L23/538 ,  B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  B23K26/00

    CPC分类号： H05K3/0035 ,  B23K26/066 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  H01L23/49827 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/4092

    摘要： An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads. After formation in the substrate, the vias are coated with an electrically conductive material. The method of via formation is fast, inexpensive, achieves higher via density, and avoids overheating of the substrate.

    摘要翻译： 描述了一种集成电路封装以及用于形成集成电路封装的方法，该集成电路封装包括其中形成有互连通孔的单层或多层基板。 激光能量扫过已经形成孔的掩模的表面。 通过掩模的孔的激光能量在保持在掩模下方的基底中形成通孔。 激光能量以这样的速度扫过并保持在激光能量在衬底中形成通孔但不穿透附着于衬底的一组引线的能级。 可以通过掩模成像，接触掩模或保形掩模技术以这种方式形成通孔。 激光能量从非热（例如准分子激光）发射。 基底由有机（例如环氧）树脂形成。 树脂可以包括增强纤维（例如芳族聚酰胺纤维）。 基板可以形成在该组引线的一侧或两侧上。 在衬底中形成之后，通孔用导电材料涂覆。 通孔形成方法快速，便宜，实现更高的通孔密度，并避免基板过热。

    Method of producing a slip-resistant substrate by depositing raised, bead-like configurations of a compatible material at select locations thereon, and a substrate including same
    9.
    发明授权
    Method of producing a slip-resistant substrate by depositing raised, bead-like configurations of a compatible material at select locations thereon, and a substrate including same 失效
    通过在其上的选定位置沉积相容材料的凸起的珠状构造来制造防滑衬底的方法，以及包括其的衬底

    公开(公告)号：US5368947A

    公开(公告)日：1994-11-29

    申请号：US744199

    申请日：1991-08-12

    申请人： Paul E. Denney

    发明人： Paul E. Denney

    IPC分类号： B23K26/34 ,  C23C4/12 ,  C23C24/10 ,  C23C26/02 ,  B22F7/04

    CPC分类号： C23C4/12 ,  B23K26/32 ,  B23K26/324 ,  B23K26/34 ,  B23K35/0244 ,  C23C24/10 ,  C23C26/02 ,  B23K2203/02 ,  B23K2203/04 ,  B23K2203/05 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/14 ,  B23K2203/18 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  Y10T428/12049 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/1209 ,  Y10T428/12097 ,  Y10T428/12146

    摘要： An article having a slip-resistant surface and method of producing the same includes metallurgically bonding raised bead-like configurations of a compatible material at select locations on the article surface. The method includes injecting, substantially simultaneously with projecting a high power radiant energy beam, powder particles into a portion of the beam lying a distance away from the point of impingement on the surface portion of the article. The particles interact with the beam for a time period sufficient to cause at least partial melting of a substantial number of particles which are then transported to a selected point on the surface portion. The partially melted particles, along with completely and/or any substantially unmelted particles, are allowed to bond with the surface material thereby forming a raised configuration thereon. The process is repeated for forming another raised configuration at another selected location on the surface portion for thereby forming a slip-resistant article. The configurations include an upright portion of substantially all sintered particles and extending a substantial distance above the surface portion, and an anchor portion which is embedded a slight distance into the surface portion and includes a weld of the base material uninterrupted with the sintered particles. The anchor portion has a height dimension which is substantially less than the height dimension of the configuration.

    摘要翻译： 具有防滑表面的制品及其制造方法包括在制品表面的选定位置处将兼容材料的凸起珠状构造冶金结合。 该方法包括基本上同时将粉末颗粒投射到远离冲击点远离制品的表面部分的波束的一部分中的基本同时地喷射。 颗粒与光束相互作用一段时间，足以使至少部分熔化大量的颗粒，然后将其输送到表面部分上的选定点。 部分熔融的颗粒以及完全和/或任何基本上未熔化的颗粒被允许与表面材料结合，从而在其上形成凸起构型。 重复该过程以在表面部分上的另一选定位置形成另一凸起构型，从而形成防滑制品。 这些构造包括基本上所有的烧结颗粒的直立部分，并且在表面部分之上延伸相当长的距离，以及在表面部分中嵌入一小段距离的锚定部分，并且包括与烧结颗粒不间断的基材的焊缝。 锚固部分​​的高度尺寸基本上小于构型的高度尺寸。