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1.
公开(公告)号:US20070190935A1
公开(公告)日:2007-08-16
申请号:US11739523
申请日:2007-04-24
申请人: Eric Sit , Robin Berg , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary Steinkogler , Eric Comer
发明人: Eric Sit , Robin Berg , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary Steinkogler , Eric Comer
IPC分类号: H04B7/15
CPC分类号: H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
摘要翻译: 公开了一种用于具有包括STM-1(155.52兆比特每秒)的数据速率的信号的电信底盘,模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构,包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构,用于建立屏蔽和散热,包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱,模块和中继器电路可以结合使用。
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2.
公开(公告)号:US20050208904A1
公开(公告)日:2005-09-22
申请号:US11126853
申请日:2005-05-10
申请人: Eric Sit , Robin Berg , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary Steinkogler , Eric Comer
发明人: Eric Sit , Robin Berg , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary Steinkogler , Eric Comer
CPC分类号: H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
摘要翻译: 公开了一种用于具有包括STM-1(155.52兆比特每秒)的数据速率的信号的电信底盘,模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构,包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构,用于建立屏蔽和散热,包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱,模块和中继器电路可以结合使用。
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公开(公告)号:US06907230B2
公开(公告)日:2005-06-14
申请号:US09812226
申请日:2001-03-19
申请人: Eric Sit , Robin Berg, Jr. , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary L. Steinkogler , Eric Comer
发明人: Eric Sit , Robin Berg, Jr. , Brian McClellan , Steven Skradde , David Streitz , John Anderson , Gary L. Steinkogler , Eric Comer
CPC分类号: H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
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