公开(公告)号：US11191165B2

公开(公告)日：2021-11-30

申请号：US16596908

申请日：2019-10-09

申请人： Ethertronics, Inc.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

摘要： The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

公开(公告)号：US20220087029A1

公开(公告)日：2022-03-17

申请号：US17536429

申请日：2021-11-29

申请人： Ethertronics, Inc.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

摘要： The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

公开(公告)号：US10448518B2

公开(公告)日：2019-10-15

申请号：US15170943

申请日：2016-06-02

申请人： ETHERTRONICS, INC.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/46 ,  H05K3/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/42

摘要： The present subject matter relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

公开(公告)号：US20200045827A1

公开(公告)日：2020-02-06

申请号：US16596908

申请日：2019-10-09

申请人： Ethertronics, Inc.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

摘要： The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.