公开(公告)号：US07667339B2

公开(公告)日：2010-02-23

申请号：US11647384

申请日：2006-12-29

申请人： Eun Jung Lee ,  Yoon Kok Park ,  Young Kyun Lee ,  Whan Gun Kim ,  Suk Ku Chang

发明人： Eun Jung Lee ,  Yoon Kok Park ,  Young Kyun Lee ,  Whan Gun Kim ,  Suk Ku Chang

IPC分类号： H01L23/29 ,  C08L63/00 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38

CPC分类号： C08G59/68 ,  C08G59/245 ,  C08G59/621 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

摘要： An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

摘要翻译： 用于半导体封装的环氧树脂组合物包括至少一种环氧树脂，至少一种固化剂，至少一种填料和至少一种第一固化促进剂，所述第一固化促进剂具有四氰基乙烯，7,7,8,8- 四氰基醌二甲烷，具有式1化学结构的化合物或其混合物，其中R 1至R 7各自独立地表示氢原子或C 1 -C 12烃基，条件是当R 1至R 7为C 1 -C 12烃基时 ，R 1和R 2，R 2和R 3，R 3和R 4，R 4和R 5，R 5和R 6以及R 6和R 7可以相互结合形成环状结构。

公开(公告)号：US20070213476A1

公开(公告)日：2007-09-13

申请号：US11647384

申请日：2006-12-29

申请人： Eun Jung Lee ,  Yoon Kok Park ,  Young Kyun Lee ,  Whan Gun Kim ,  Suk Ku Chang

发明人： Eun Jung Lee ,  Yoon Kok Park ,  Young Kyun Lee ,  Whan Gun Kim ,  Suk Ku Chang

IPC分类号： C08L63/00

CPC分类号： C08G59/68 ,  C08G59/245 ,  C08G59/621 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

摘要： An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

摘要翻译： 用于半导体封装的环氧树脂组合物包括至少一种环氧树脂，至少一种固化剂，至少一种填料和至少一种第一固化促进剂，所述第一固化促进剂具有四氰基乙烯，7,7,8,8- 四氰基醌二甲烷，具有式1的化学结构的化合物或其混合物，其中R 1至R 7中的每一个独立地表示氢原子或C < 当R 1至R 7为C 1 -C 12烷基时， R 1，R 2和R 2，R 2和R 3， R 3，R 3和R 4，R 4和R 5，R 5 R 6和R 6，R 6和R 7可以彼此连接形成环状结构。