公开(公告)号：US08120164B2

公开(公告)日：2012-02-21

申请号：US11948293

申请日：2007-11-30

申请人： Eun-woo Jeong ,  Yong-gwang Won

发明人： Eun-woo Jeong ,  Yong-gwang Won

IPC分类号： H01L23/52

CPC分类号： H01L23/3121 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package and printed circuit board assembly including the same which have a variable mounting orientation include a semiconductor chip disposed on a first surface of an insulating substrate, connectors symmetrically disposed at respective first and opposite second sides of the insulating substrate, a plurality of input/output connecting leads and power connecting leads electrically connected by connecting members to a plurality of internal circuits of the semiconductor chip, at least two internal circuits of the plurality of internal circuits being substantially similar circuits, and a radiating pad disposed on a second opposite surface of the insulating substrate and which is electrically connected to the semiconductor chip.

摘要翻译： 包括其的具有可变安装方向的半导体芯片封装和印刷电路板组件包括设置在绝缘基板的第一表面上的半导体芯片，对称地设置在绝缘基板的相应的第一和相对的第二侧的连接器，多个 输入/输出连接引线和通过连接构件电连接到半导体芯片的多个内部电路的电源连接引线，多个内部电路中的至少两个内部电路是大致相似的电路，以及放置在第二相对 绝缘基板的表面，并与半导体芯片电连接。