公开(公告)号：US20180218996A1

公开(公告)日：2018-08-02

申请号：US15879981

申请日：2018-01-25

申请人： F&K Delvotec Bondtechnik GmbH

发明人： Franz Schlicht

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/85 ,  H01L2224/78343 ,  H01L2224/78353 ,  H01L2224/78901 ,  H01L2224/7892 ,  H01L2224/78925 ,  H01L2224/8501 ,  H01L2224/85012 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2224/859

摘要： Method for producing wire bond connections between an electronic component or a module and a substrate with energy input into a bonding wire by an ultrasonic transducer, wherein during the energy input for forming a first wire bond connection, at least one bonding parameter characterizing the instantaneous state of the bonding wire is measured in dependence on time, the curve shape of the time dependence is differentiated by means of predetermined comparative criteria or curves into three curve sections and hereby the temporal course of the method into three phases, to be specific, a cleaning, a fusion and a tempering phase, and the energy fed into the ultrasonic transducer and/or the bonding force exerted on the bonding wire and/or the duration of the energy input into at least one partial section of at least the cleaning and the fusion phase, in particular each of the cleaning, fusion and tempering phases is/are controlled independent of the measurement result in quasi real time during the formation of the first wire bond connection or during the subsequent formation of a second wire bond connection of the same type in dependence on the curve shape in the associated curve section in a phase-specific manner.