公开(公告)号：US20240363581A1

公开(公告)日：2024-10-31

申请号：US18622131

申请日：2024-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daewoong Heo

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/48 ,  H01L24/745 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/745 ,  H01L2224/78611

Abstract: A capilary of a wire bonding apparatus including: a body having a wire hole formed in an inner central region of the body and through a length of the body, and a wire discharge portion disposed at a lower end portion of the body and including an injection hole in an outer circumference of the wire discharge portion.

公开(公告)号：US12080679B2

公开(公告)日：2024-09-03

申请号：US18010458

申请日：2021-08-26

Applicant: SHINKAWA LTD.

Inventor： Toru Maeda ,  Osamu Kakutani

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  B23K20/106 ,  B23K2101/40 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78753

Abstract: A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

公开(公告)号：US12057431B2

公开(公告)日：2024-08-06

申请号：US17550729

申请日：2021-12-14

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Basil Milton ,  Romeo Olida ,  Jonathan Geller ,  Tomer Levinson

IPC: H01L23/00

CPC classification number: H01L24/85 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/4383 ,  H01L2224/43985 ,  H01L2224/7825 ,  H01L2224/78343 ,  H01L2224/7855 ,  H01L2224/85035 ,  H01L2224/85047 ,  H01L2224/85205

Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.

公开(公告)号：US12057428B2

公开(公告)日：2024-08-06

申请号：US18060012

申请日：2022-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongeun Lee

IPC: B23K20/00 ,  B23K3/06 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K3/063 ,  B23K20/005 ,  B23K2101/40 ,  H01L2224/78621

Abstract: A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.

公开(公告)号：US12057427B2

公开(公告)日：2024-08-06

申请号：US17913441

申请日：2021-02-22

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Shigeru Hayata

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/78353 ,  H01L2224/78822 ,  H01L2224/78824 ,  H01L2924/40

Abstract: A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.

公开(公告)号：US20240203933A1

公开(公告)日：2024-06-20

申请号：US18009332

申请日：2021-06-17

Applicant: SHINKAWA LTD.

Inventor： Hikaru MIURA ,  Takuya ASAMI ,  Yoshihiro MIYATA

IPC: H01L23/00 ,  B23K20/00 ,  B23K20/10 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/78353

Abstract: An ultrasonic composite vibration device includes a base end part, an enlarged part, and a tip end part arranged in a straight line from a base end side to a tip end side. The base end part has a transducer generating longitudinal vibration and torsional vibration. The enlarged part has a cross-sectional area larger than the base end part, and the tip end part has a cross-sectional area smaller than the enlarged part. A node of the torsional vibration is located at the enlarged part, and antinodes of the longitudinal vibration and the torsional vibration are located at a base end surface and a tip end surface of the ultrasonic composite vibration device. An axial position and an axial dimension of the enlarged part are set to a position and a dimension at which resonance frequencies of the longitudinal vibration and the torsional vibration are substantially equal.

公开(公告)号：US20240116126A1

公开(公告)日：2024-04-11

申请号：US17963489

申请日：2022-10-11

Applicant: ASMPT SINGAPORE PTE. LTD.

Inventor： Tsz Kit YU ,  Ka Shing KWAN ,  Hoi Ting LAM ,  Hing Leung LI

IPC: B23K20/10 ,  H01L23/00

CPC classification number: B23K20/10 ,  H01L24/78 ,  H01L2224/85205

Abstract: An ultrasonic transducer includes an elongated transducer body with an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at a first resonant frequency, a mounting flange for mounting the transducer body to a wire bonding machine, a rigid connecting member having first and second ends which are respectively connected to the mounting flange and the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency and a flexible connecting member extending between the mounting flange and the transducer body at a second nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency.

公开(公告)号：US20240105672A1

公开(公告)日：2024-03-28

申请号：US17921618

申请日：2021-07-06

Applicant: SHINKAWA LTD.

Inventor： Shigeru HAYATA ,  Osamu KAKUTANI

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/85 ,  H01L2224/78001 ,  H01L2224/78304 ,  H01L2224/78353 ,  H01L2224/78702 ,  H01L2224/78753 ,  H01L2224/85123 ,  H01L2224/8518 ,  H01L2224/859 ,  H01L2924/40

Abstract: A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.

公开(公告)号：US11908827B2

公开(公告)日：2024-02-20

申请号：US17435041

申请日：2020-03-04

Applicant: SHINKAWA LTD.

Inventor： Naoki Sekine ,  Yasuo Nagashima

IPC: B23K20/00 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K2101/40 ,  H01L2224/7855 ,  H01L2224/78611 ,  H01L2224/78824 ,  H01L2224/78901

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

公开(公告)号：US20240038717A1

公开(公告)日：2024-02-01

申请号：US18204717

申请日：2023-06-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daewoong HEO

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  H01L2224/78621

Abstract: A wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. The clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit, . The capillary is fixedly installed on the third member and rotates in conjunction with the third member.