Pin structure and pin connection structure thereof
    1.
    发明授权
    Pin structure and pin connection structure thereof 有权
    引脚结构及引脚连接结构

    公开(公告)号:US09125330B2

    公开(公告)日:2015-09-01

    申请号:US13479283

    申请日:2012-05-24

    摘要: The present disclosure relates to a conductive connection structure, and more particularly to a pin structure and pin connection structure thereof. The pin structure is disposed at least one side of an anisotropic conductive film. A plurality of conductive particles is distributed over the interior of the anisotropic conductive film. The pin structure comprises: a plurality of columns which are interspaced, wherein, the conductive particles are in the periphery of the columns. The pin structure and pin connection structure provided by the present disclosure use a pin structure comprising a plurality of columns which are interspaced. When the anisotropic conductive film is used to laminate pin structures, spacing between adjacent columns can contain the conductive particles so as to reduce the number of conductive particle that flow between the left-and-right adjacent pin structures, thereby reducing incidence of short circuit of the left-and-right adjacent pin structures.

    摘要翻译: 导体连接结构技术领域本发明涉及一种导电连接结构,更具体地说,涉及一种针脚结构和针连接结构。 针结构设置在各向异性导电膜的至少一侧。 多个导电粒子分布在各向异性导电膜的内部。 针结构包括:多个间隔的柱,其中,导电颗粒在柱的周边。 由本公开提供的销结构和销连接结构使用包括间隔的多个列的销结构。 当各向异性导电膜用于层压销结构时,相邻列之间的间隔可以包含导电颗粒,以减少在左右相邻引脚结构之间流动的导电粒子的数量,从而减少 左右相邻的销结构。

    PIN STRUCTURE AND PIN CONNECTION STRUCTURE THEREOF
    2.
    发明申请
    PIN STRUCTURE AND PIN CONNECTION STRUCTURE THEREOF 有权
    引脚结构和引脚连接结构

    公开(公告)号:US20130115818A1

    公开(公告)日:2013-05-09

    申请号:US13479283

    申请日:2012-05-24

    IPC分类号: H01R13/40

    摘要: The present disclosure relates to a conductive connection structure, and more particularly to a pin structure and pin connection structure thereof. The pin structure is disposed at least one side of an anisotropic conductive film. A plurality of conductive particles is distributed over the interior of the anisotropic conductive film. The pin structure comprises: a plurality of columns which are interspaced, wherein, the conductive particles are in the periphery of the columns. The pin structure and pin connection structure provided by the present disclosure use a pin structure comprising a plurality of columns which are interspaced. When the anisotropic conductive film is used to laminate pin structures, spacing between adjacent columns can contain the conductive particles so as to reduce the number of conductive particle that flow between the left-and-right adjacent pin structures, thereby reducing incidence of short circuit of the left-and-right adjacent pin structures.

    摘要翻译: 导体连接结构技术领域本发明涉及一种导电连接结构,更具体地说,涉及一种针脚结构和针连接结构。 针结构设置在各向异性导电膜的至少一侧。 多个导电粒子分布在各向异性导电膜的内部。 针结构包括:多个间隔的柱,其中,导电颗粒在柱的周边。 由本公开提供的销结构和销连接结构使用包括间隔的多个列的销结构。 当各向异性导电膜用于层压销结构时,相邻列之间的间隔可以包含导电颗粒,以减少在左右相邻引脚结构之间流动的导电粒子的数量,从而减少 左右相邻的销结构。