公开(公告)号：US11288476B2

公开(公告)日：2022-03-29

申请号：US16609684

申请日：2018-04-25

Applicant: FINGERPRINT CARDS AB

Inventor： Hanna Nilsson ,  Karl Lundahl

IPC: G06K9/00 ,  G01L1/14 ,  G01L1/22

Abstract: The present invention generally relates to a fingerprint sensor package comprising a substrate having thereon a plurality of electrical connection pads, a fingerprint sensor arranged on the substrate and electrically connected to at least one of the electrical connection pads, a bond wire loop formed from a bond wire having two ends of which at least one end is mechanically and electrically attached to a first one of the electrical connection pads, and a force sensing member in electrical contact with the first electrical connection pad via an upper portion of the bond wire loop, and in electrical contact with a second one of the electrical connection pads different from the first electrical connection pad, wherein an electrical property of the force sensing member is alterable in response to a deformation of the force sensing member.

公开(公告)号：US11036955B2

公开(公告)日：2021-06-15

申请号：US16623443

申请日：2018-08-21

Applicant: Fingerprint Cards AB

Inventor： Hanna Nilsson ,  Adam Benson ,  Karl Lundahl

IPC: G06K9/00 ,  H01L27/01

Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.

公开(公告)号：US10043049B2

公开(公告)日：2018-08-07

申请号：US15654798

申请日：2017-07-20

Applicant: Fingerprint Cards AB

Inventor： Karl Lundahl ,  Hanna Nilsson

IPC: G06K9/00

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements and comprising a plurality of cavities filled with a dielectric material. The dielectric material comprises reduced graphene oxide. Locations of the cavities correspond to locations of the sensing elements such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element. A dielectric constant of the dielectric material is higher than a dielectric constant of the coating material. The invention also relates to a sensing device where the dielectric coating layer containing reduced graphene oxide comprises trenches corresponding to areas between the sensing pixels filled with a fill material, where the dielectric coating layer has a higher dielectric constant than the fill material.