公开(公告)号：US11139412B2

公开(公告)日：2021-10-05

申请号：US16419950

申请日：2019-05-22

Applicant: FINISAR CORPORATION

Inventor： Tao Sun ,  Feng Wang ,  Wei Peng Nian ,  Ting Shi ,  Bing Qiu ,  Shao Jun Yu

IPC: H01L31/12 ,  H01L23/00 ,  G02B6/42

Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.