公开(公告)号：US20210173158A1

公开(公告)日：2021-06-10

申请号：US16859752

申请日：2020-04-27

Applicant: FINISAR CORPORATION

Inventor： Qing Qian ,  Wei Li ,  Hui Juan Yan ,  Hui Yang ,  Wei Peng Nian ,  Ting Shi

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

公开(公告)号：US11320611B2

公开(公告)日：2022-05-03

申请号：US16859752

申请日：2020-04-27

Applicant: FINISAR CORPORATION

Inventor： Qing Qian ,  Wei Li ,  Hui Juan Yan ,  Hui Yang ,  Wei Peng Nian ,  Ting Shi

IPC: G02B6/42 ,  H05K1/18 ,  H05K1/02

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.