公开(公告)号：US20140186999A1

公开(公告)日：2014-07-03

申请号：US14141300

申请日：2013-12-26

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

Abstract translation: 在一个实施例中，用于微测辐射热量计真空封装组件（VPA）的晶片级封装（WLP）的装置包括：晶片对准和结合室，测辐射热计晶片卡盘和设置在腔室内的垂直面对面的盖晶片卡盘 彼此之间，用于在室内产生第一超高真空（UHV）环境的装置，用于彼此独立地加热和冷却测辐射热计晶片卡盘和盖晶片卡盘的装置，用于将盖晶片卡盘移动到垂直方向 方向并且相对于测辐射热量计晶片卡盘，用于在水平面中沿两个正交方向平移移动测辐射热计晶片夹盘并围绕垂直于水平面的垂直轴线旋转移动的装置，以及用于使由基准点 在由盖子晶片卡盘保持的盖子晶片上具有基准的测辐射热计晶片卡盘。

公开(公告)号：US10553454B2

公开(公告)日：2020-02-04

申请号：US15682459

申请日：2017-08-21

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/50 ,  H01L31/09 ,  H01L31/0203 ,  B81C1/00 ,  H01L23/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：US20170372920A1

公开(公告)日：2017-12-28

申请号：US15682459

申请日：2017-08-21

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50 ,  B81C1/00 ,  H01L21/67 ,  H01L31/0203 ,  H01L21/683 ,  H01L21/68 ,  H01L21/677 ,  H01L31/09 ,  H01L23/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：US09741591B2

公开(公告)日：2017-08-22

申请号：US14141300

申请日：2013-12-26

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L31/09 ,  H01L31/0203 ,  B81C1/00 ,  H01L23/00

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.