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    WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
    4.
    发明申请
    WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES 有权
    微波包装真空包装组件的水平包装

    公开(公告)号：US20140186999A1

    公开(公告)日：2014-07-03

    申请号：US14141300

    申请日：2013-12-26

    Applicant: FLIR Systems, Inc.

    Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

    IPC: H01L21/50

    CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

    Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

    Abstract translation: 在一个实施例中，用于微测辐射热量计真空封装组件（VPA）的晶片级封装（WLP）的装置包括：晶片对准和结合室，测辐射热计晶片卡盘和设置在腔室内的垂直面对面的盖晶片卡盘 彼此之间，用于在室内产生第一超高真空（UHV）环境的装置，用于彼此独立地加热和冷却测辐射热计晶片卡盘和盖晶片卡盘的装置，用于将盖晶片卡盘移动到垂直方向 方向并且相对于测辐射热量计晶片卡盘，用于在水平面中沿两个正交方向平移移动测辐射热计晶片夹盘并围绕垂直于水平面的垂直轴线旋转移动的装置，以及用于使由基准点 在由盖子晶片卡盘保持的盖子晶片上具有基准的测辐射热计晶片卡盘。

    Wafer level packaging of reduced-height infrared detectors
    5.
    发明授权
    Wafer level packaging of reduced-height infrared detectors 有权

    公开(公告)号：US10153204B2

    公开(公告)日：2018-12-11

    申请号：US14728967

    申请日：2015-06-02

    Applicant: FLIR Systems, Inc.

    Inventor： Tiahaar Kurtheru Clayton McKenzie ,  Richard E. Bornfreund ,  Devin Leonard ,  Gregory A. Carlson

    IPC: H01L21/78 ,  H01L27/146 ,  H01L21/68 ,  H01L21/67

    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.

    WAFER LEVEL PACKAGING OF REDUCED-HEIGHT INFRARED DETECTORS
    10.
    发明申请
    WAFER LEVEL PACKAGING OF REDUCED-HEIGHT INFRARED DETECTORS 审中-公开
    降低高度红外探测器的水平包装

    公开(公告)号：US20150358558A1

    公开(公告)日：2015-12-10

    申请号：US14728967

    申请日：2015-06-02

    Applicant: FLIR Systems, Inc.

    Inventor： Tiahaar Kurtheru Clayton McKenzie ,  Richard E. Bornfreund ,  Devin Leonard ,  Gregory A. Carlson

    IPC: H04N5/33 ,  H01L21/66 ,  H01L21/78 ,  H01L27/146

    CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/76251 ,  H01L27/14618 ,  H01L27/14649 ,  H01L27/14687 ,  Y10T83/533

    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.

    Abstract translation: 可以提供系统和方法来产生诸如红外检测器封装的减小电路封装。 对准和切割系统可以包括红外相机，其通过晶片组件的盖晶片捕获晶片组件的对准标记的图像，通过盖晶片照亮对准标记的光源，以及切割晶片组件的切割设备 基于使用红外摄像机捕获的红外图像。 光源可以通过红外照相机的光学器件通过向晶片组件提供诸如红外光的光来通过盖晶片照亮对准标记。 红外相机可以通过盖晶片捕获形成在晶片组件的检测器晶片上的对准标记的图像或盖晶片的内表面或下表面上的图像。 切片设备可以基于所捕获的图像与晶片组件对准。

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