公开(公告)号：US09848134B2

公开(公告)日：2017-12-19

申请号：US14092794

申请日：2013-11-27

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Steve Barskey ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N9/10 ,  H04N9/14 ,  H04N5/33 ,  H04N5/359 ,  H01L27/146 ,  H04N5/365

CPC classification number: H04N5/33 ,  H01L27/1469 ,  H04N5/359 ,  H04N5/365

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

公开(公告)号：US20140092256A1

公开(公告)日：2014-04-03

申请号：US14092794

申请日：2013-11-27

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Steve Barskey ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H01L27/146 ,  H04N5/359

CPC classification number: H04N5/33 ,  H01L27/1469 ,  H04N5/359 ,  H04N5/365

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

Abstract translation: 提供了使用集成电路实现，操作和制造红外成像装置的各种技术。 在一个示例中，系统包括焦平面阵列（FPA）集成电路，其包括适于对场景进行成像的红外传感器阵列，多个有源电路部件，设置在电路部件上方并连接到电路部件的第一金属层，第二 金属层，设置在第一金属层上方并连接到第一金属层，以及第三金属层，设置在第二金属层的上方和红外传感器的下方。 第三金属层连接到第二金属层和红外传感器。 第一，第二和第三金属层是红外传感器和电路部件之间的FPA的唯一金属层。 第一，第二和第三金属层适于在电路部件和红外传感器之间路由信号。