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    LOW POWER AND SMALL FORM FACTOR INFRARED IMAGING
    1.
    发明申请
    LOW POWER AND SMALL FORM FACTOR INFRARED IMAGING 有权
    低功率和小型因子红外成像

    公开(公告)号：US20160366345A1

    公开(公告)日：2016-12-15

    申请号：US14133095

    申请日：2013-12-18

    Applicant: FLIR Systems, Inc.

    Inventor： Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

    IPC: H04N5/33 ,  H04N5/225 ,  H04N5/357 ,  H04N5/378

    CPC classification number: H04N5/33 ,  H04M1/725 ,  H04M2250/52 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/357 ,  H04N5/378

    Abstract: Various techniques are provided for implementing an infrared imaging system, especially for low power and small form factor applications. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. A low-dropout regulator (LDO) is integrated with the FPA and adapted to provide a regulated voltage in response to an external supply voltage. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors in response to the regulated voltage. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

    Abstract translation: 提供了用于实现红外成像系统的各种技术，特别是对于低功率和小尺寸应用。 在一个示例中，系统包括焦平面阵列（FPA）。 FPA包括适用于对场景成像的红外传感器阵列。 低压差稳压器（LDO）与FPA集成，适用于提供响应于外部电源电压的稳压电压。 FPA还包括偏置电路，其适于响应于调节的电压向红外传感器提供偏置电压。 FPA还包括一个读出集成电路（ROIC），适用于提供与捕获的图像帧对应的红外传感器的信号。 还提供了其他实现。

    Time spaced infrared image enhancement
    2.
    发明授权
    Time spaced infrared image enhancement 有权
    时间间隔红外图像增强

    公开(公告)号：US09451183B2

    公开(公告)日：2016-09-20

    申请号：US14138040

    申请日：2013-12-21

    Applicant: FLIR Systems, Inc.

    Inventor： Nicholas Högasten ,  Dwight Dumpert ,  Theodore R. Hoelter ,  Jeffrey S. Scott ,  Katrin Strandemar ,  Mark Nussmeier ,  Eric A. Kurth ,  Pierre Boulanger ,  Barbara Sharp

    IPC: G06K9/40 ,  H04N5/33 ,  H04N5/262 ,  H04N5/225

    CPC classification number: H04N5/33 ,  G06K9/40 ,  H04N5/2257 ,  H04N5/262 ,  H04N5/265 ,  H04N5/3651

    Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

    Abstract translation: 公开了使用小尺寸红外成像模块的技术。 成像系统可以包括可见光谱成像模块，红外成像模块和与用户和/或监视系统接口的其他模块。 可见光谱成像模块和红外成像模块可以定位在将被监视的场景附近，而场景的可见光谱图像不可用或不如场景的红外图像更不期望。 成像模块可以被配置为在不同时间拍摄场景的图像。 图像分析和处理可用于生成具有红外成像特征和增加的细节和对比度的组合图像。 可以对所捕获的图像执行三重融合处理，包括非均匀性校正处理的可选方面，真彩色处理和高对比度处理。 可以将基于组合图像的控制信号呈现给用户和/或监视系统。

    PIXEL-WISE NOISE REDUCTION IN THERMAL IMAGES
    3.
    发明申请
    PIXEL-WISE NOISE REDUCTION IN THERMAL IMAGES 有权
    PIXEL-WISE NOISE减少热像

    公开(公告)号：US20140016879A1

    公开(公告)日：2014-01-16

    申请号：US14029683

    申请日：2013-09-17

    Applicant: FLIR Systems, Inc.

    Inventor： Nicholas Högasten ,  Malin Ingerhed ,  Mark Nussmeier ,  Eric A. Kurth ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

    IPC: G06T5/00

    CPC classification number: G06T5/002 ,  G06T2207/10016 ,  G06T2207/10048 ,  G06T2207/20182 ,  H04N5/33 ,  H04N5/3651 ,  H04N5/3658

    Abstract: Methods and systems are provided to reduce noise in thermal images. In one example, a method includes receiving an image frame comprising a plurality of pixels arranged in a plurality of rows and columns. The pixels comprise thermal image data associated with a scene and noise introduced by an infrared imaging device. The image frame may be processed to determine a plurality of column correction terms, each associated with a corresponding one of the columns and determined based on relative relationships between the pixels of the corresponding column and the pixels of a neighborhood of columns. In another example, the image frame may be processed to determine a plurality of non-uniformity correction terms, each associated with a corresponding one of the pixels and determined based on relative relationships between the corresponding one of the pixels and associated neighborhood pixels within a selected distance.

    Abstract translation: 提供了方法和系统来减少热图像中的噪音。 在一个示例中，一种方法包括接收包括以多个行和列排列的多个像素的图像帧。 像素包括与场景相关联的热图像数据和由红外成像装置引入的噪声。 可以处理图像帧以确定多个列校正项，每个列修正项与列中的相应列之一相关联，并且基于相应列的像素和列的邻域的像素之间的相对关系来确定。 在另一示例中，图像帧可以被处理以确定多个不均匀性校正项，每一个都与相应的一个像素相关联，并且基于所选择的像素中的相应一个像素和相关邻域像素之间的相对关系确定 距离。

    Pixel-wise noise reduction in thermal images
    8.
    发明授权
    Pixel-wise noise reduction in thermal images 有权
    热图像中像素降噪

    公开(公告)号：US09208542B2

    公开(公告)日：2015-12-08

    申请号：US14029683

    申请日：2013-09-17

    Applicant: FLIR Systems, Inc.

    Inventor： Nicholas Högasten ,  Malin Ingerhed ,  Mark Nussmeier ,  Eric A. Kurth ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

    IPC: G06K9/40 ,  G06T5/00 ,  H04N5/33 ,  H04N5/365

    CPC classification number: G06T5/002 ,  G06T2207/10016 ,  G06T2207/10048 ,  G06T2207/20182 ,  H04N5/33 ,  H04N5/3651 ,  H04N5/3658

    Abstract: Methods and systems are provided to reduce noise in thermal images. In one example, a method includes receiving an image frame comprising a plurality of pixels arranged in a plurality of rows and columns. The pixels comprise thermal image data associated with a scene and noise introduced by an infrared imaging device. The image frame may be processed to determine a plurality of column correction terms, each associated with a corresponding one of the columns and determined based on relative relationships between the pixels of the corresponding column and the pixels of a neighborhood of columns. In another example, the image frame may be processed to determine a plurality of non-uniformity correction terms, each associated with a corresponding one of the pixels and determined based on relative relationships between the corresponding one of the pixels and associated neighborhood pixels within a selected distance.

    Abstract translation: 提供了方法和系统来减少热图像中的噪音。 在一个示例中，一种方法包括接收包括以多个行和列排列的多个像素的图像帧。 像素包括与场景相关联的热图像数据和由红外成像装置引入的噪声。 可以处理图像帧以确定多个列校正项，每个列修正项与列中的相应列之一相关联，并且基于相应列的像素和列的邻域的像素之间的相对关系来确定。 在另一示例中，图像帧可以被处理以确定多个不均匀性校正项，每一个都与相应的一个像素相关联，并且基于所选择的像素中的相应一个像素和相关邻域像素之间的相对关系确定 距离。

    SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE
    9.
    发明申请
    SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE 有权

    公开(公告)号：US20140184807A1

    公开(公告)日：2014-07-03

    申请号：US14106696

    申请日：2013-12-13

    Applicant: FLIR Systems, Inc.

    Inventor： Brian Simolon ,  Eric A. Kurth ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

    IPC: H04N5/33 ,  H01L27/146 ,  H04N5/378

    CPC classification number: H04N5/33 ,  H01L27/14634 ,  H01L27/1469 ,  H04N5/2257 ,  H04N5/378

    Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

    Abstract translation: 提供了用于实现红外传感器的分段焦平面阵列（FPA）的各种技术。 在一个示例中，系统包括分段的FPA。 分段FPA包括具有红外传感器阵列（例如辐射热计）的顶模。 顶部管芯还可以包括读出集成电路（ROIC）的一部分。 分段FPA还包括具有至少一部分ROIC的底模。 顶部和底部管芯通过管芯间连接电耦合。 有利地，与常规FPA架构相比，分段FPA可以以更高的产量和更小的占用面积来制造。 此外，可以使用针对每个管芯的不同的半导体工艺来制造分段的FPA。

    Compact multi-spectrum imaging with fusion
    10.
    发明授权
    Compact multi-spectrum imaging with fusion 有权

    公开(公告)号：US10244190B2

    公开(公告)日：2019-03-26

    申请号：US14138058

    申请日：2013-12-21

    Applicant: FLIR Systems, Inc.

    Inventor： Pierre Boulanger ,  Barbara Sharp ,  Theodore R. Hoelter ,  Andrew C. Teich ,  Nicholas Högasten ,  Jeffrey S. Scott ,  Katrin Strademar ,  Mark Nussmeier ,  Eric A. Kurth

    IPC: H04N5/33 ,  G06T5/50 ,  G06T5/00 ,  H04N5/365 ,  H04N5/225

    Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, illumination modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

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