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公开(公告)号:US20170021389A1
公开(公告)日:2017-01-26
申请号:US15285244
申请日:2016-10-04
IPC分类号: B05D3/14 , B05D1/00 , B32B37/12 , B05D7/14 , F16B19/08 , B32B7/12 , B21J15/02 , F16B5/04 , F16B11/00 , C23G5/00 , B32B15/01
CPC分类号: B05D3/142 , B05D1/62 , B05D7/14 , B21J15/025 , B23K11/0066 , B29C65/60 , B32B7/12 , B32B15/01 , B32B37/1284 , B32B2383/00 , B32B2605/00 , C23G5/00 , F16B5/04 , F16B11/006 , F16B19/086 , Y10T156/10 , Y10T428/249923
摘要: An assembly and a method of joining a first part with a second part at an attachment area that includes a localized area on the first part. The localized area is cleaned and activated by a plasma jet. An organosilicon composition is applied by plasma-enhanced chemical vapor deposition to the localized area. An adhesive is applied to the localized area and the second part is mechanically fastened to the first part in the localized area.
摘要翻译: 一种在包括第一部分上的局部区域的附接区域处将第一部分与第二部分接合的组件和方法。 局部区域被等离子体射流清洁和激活。 通过等离子体增强化学气相沉积将有机硅组合物施加到局部区域。 将粘合剂施加到局部区域,并且将第二部分机械地紧固到局部区域中的第一部分。