公开(公告)号：US20250113679A1

公开(公告)日：2025-04-03

申请号：US18774266

申请日：2024-07-16

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Guanyu WANG ,  Zhenglong FAN ,  Hua ZHOU ,  Danwei LI ,  Mingwen LAN

IPC: H01L33/62 ,  H01L33/56

Abstract: A light-emitting module includes a lead frame, a substrate, a light-emitting element, a plastic encapsulation body, a driver IC chip and multiple passive devices. The substrate is disposed on the lead frame, and the light-emitting element, the driver IC chip and the multiple passive devices are disposed on the substrate. The substrate is a double-sided metal-plated insulated substrate. The plastic encapsulation body at least covers part of the lead frame, and a light condensation cavity is disposed in the plastic encapsulation body and covers above the light-emitting element. Circuit wires are further etched on the substrate, and the light-emitting element, the driver IC chip and the multiple passive devices are correspondingly connected based on the circuit wires.