公开(公告)号：US20250113679A1

公开(公告)日：2025-04-03

申请号：US18774266

申请日：2024-07-16

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Guanyu WANG ,  Zhenglong FAN ,  Hua ZHOU ,  Danwei LI ,  Mingwen LAN

IPC: H01L33/62 ,  H01L33/56

Abstract: A light-emitting module includes a lead frame, a substrate, a light-emitting element, a plastic encapsulation body, a driver IC chip and multiple passive devices. The substrate is disposed on the lead frame, and the light-emitting element, the driver IC chip and the multiple passive devices are disposed on the substrate. The substrate is a double-sided metal-plated insulated substrate. The plastic encapsulation body at least covers part of the lead frame, and a light condensation cavity is disposed in the plastic encapsulation body and covers above the light-emitting element. Circuit wires are further etched on the substrate, and the light-emitting element, the driver IC chip and the multiple passive devices are correspondingly connected based on the circuit wires.

公开(公告)号：US20250113672A1

公开(公告)日：2025-04-03

申请号：US18774350

申请日：2024-07-16

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Guanyu WANG ,  Mingwen LAN ,  Nianbin CHENG ,  Yongzhao OU ,  Lu YANG ,  Yuanyuan DONG

IPC: H01L33/40 ,  H01L33/00 ,  H01L33/56

Abstract: A substrate includes a substrate body and a top copper layer disposed on the substrate body. Multiple insulated channels are disposed on the top copper layer. The top copper layer forms a top circuit structure based on the multiple insulated channels. A light-emitting element installation region is disposed on the top layer circuit structure. The top copper layer in the light-emitting element installation region protrudes upward to form at least one copper layer boss. Multiple light-emitting element welding positions are disposed in the light-emitting element installation region. A light-emitting element welding position is disposed on any copper layer boss. The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region.