公开(公告)号：US11148411B2

公开(公告)日：2021-10-19

申请号：US16305759

申请日：2016-06-17

申请人： FUJI CORPORATION

发明人： Minoru Kinuta ,  Shoji Fukakusa ,  Kento Asaoka

IPC分类号： B41F15/46 ,  B41M1/12 ,  B41F15/08 ,  B41F15/42 ,  H05K3/12 ,  B41M3/00 ,  H05K3/34

摘要： A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.