-
1.发明申请公开(公告)号：US20220368303A1
公开(公告)日：2022-11-17
申请号：US17874905
申请日：2022-07-27
发明人： Yilin LIU , Zhonghe LIN , Yenfu LIN , Shihwei HUANG , Minghui FANG , Shengyu YANG
摘要： A method for blackening at least one wafer includes: (a) performing a reduction treatment on the at least one wafer; and (b) illuminating the at least one wafer with an ultraviolet light. The at least one wafer after the illumination of the UV light has a blackening uniformity value (DE value) smaller than 0.6, and a chromatic value (L value) smaller than 54. In addition, a blackened wafer made from the method is also provided.
-
公开(公告)号：US20230188112A1
公开(公告)日：2023-06-15
申请号：US18167702
申请日：2023-02-10
发明人： Yenfu LIN , Zhonghe LIN , Shengyu YANG , Minghui FANG , Shihwei HUANG
IPC分类号： H03H9/02 , H03H3/08 , H03H9/64 , H10N30/072
CPC分类号： H03H9/02574 , H03H3/08 , H03H9/64 , H03H9/02834 , H10N30/072
摘要： A method for making a composite substrate of a filter includes: processing a base substrate to form a centrally protruding structure having a height that decreases in a radially outward direction from a center of the base substrate to an outer periphery of the base substrate; connecting a first side of the base substrate having the centrally protruding structure to a piezoelectric layer so as to obtain a multilayer substrate; and thinning the piezoelectric layer of the multilayer substrate followed by polishing a surface of the piezoelectric layer.
-
搜索结果
2 条记录 (耗时 0.014 秒)
