公开(公告)号：US20140322893A1

公开(公告)日：2014-10-30

申请号：US14324626

申请日：2014-07-07

Applicant: FUJIFILM CORPORATION

Inventor： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘合性的粘合剂层进行照射时的光化射线，辐射或加热以对所述粘合剂层进行照射 光化射线，辐射或热，将待处理部件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于被处理物体的第一表面的第二表面进行机械或化学处理 构件，以获得处理构件，并且从粘合剂支撑体的粘合剂层分离处理构件的第一表面，其中进行具有光化射线，辐射或热的粘合剂层的照射，使得粘附性朝向外表面减小 从粘合剂层的基板侧的内表面。

公开(公告)号：US20150093879A1

公开(公告)日：2015-04-02

申请号：US14567471

申请日：2014-12-11

Applicant: FUJIFILM Corporation

Inventor： Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA ,  Yu IWAI ,  Shiro TAN

IPC: C09J7/02 ,  H01L21/302 ,  H01L21/683

CPC classification number: H01L21/302 ,  C09J7/20 ,  C09J7/38 ,  C09J133/02 ,  C09J133/12 ,  C09J161/06 ,  C09J175/14 ,  C09J175/16 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2475/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/13 ,  Y10T428/2852

Abstract: The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract translation: 本发明涉及一种用于生产半导体器件的临时粘合剂，其包含（A）具有酸基的聚合物化合物，（B）稀释剂，和（C）溶剂，包含基底的粘合剂载体和形成的粘合剂层 从半导体装置的制造用临时粘合剂和具有加工部件的半导体装置的制造方法，其特征在于，包括：通过由用于制造半导体装置的临时粘合剂形成的粘合剂层将待加工的部件的第一表面粘附到基板上 如所要求的; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。

公开(公告)号：US20140318697A1

公开(公告)日：2014-10-30

申请号：US14328191

申请日：2014-07-10

Applicant: FUJIFILM Corporation

Inventor： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Atsushi NAKAMURA ,  Yu IWAI ,  Ichiro KOYAMA

IPC: H01L21/673

CPC classification number: H01L21/673 ,  C09J5/04 ,  C09J7/22 ,  C09J7/35 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray or radiation to pattern exposure of the adhesive layer to provide a high adhesive region and a low adhesive region in the adhesive layer, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching the first surface of the treated member from the adhesive layer of the adhesive support.

Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘附性的粘合剂层进行照射时，用光化射线或辐射照射粘合剂层以图案曝光， 高粘合剂区域和粘合剂层中的低粘合剂区域，将被处理构件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于第一表面的第二表面施加机械或化学处理 待处理的构件以获得处理的构件，并且将所处理的构件的第一表面从粘合剂支撑体的粘合剂层分离。