公开(公告)号：US20150284603A1

公开(公告)日：2015-10-08

申请号：US14743619

申请日：2015-06-18

申请人： FUJIFILM CORPORATION

发明人： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC分类号： C09J133/12 ,  H01L21/304 ,  C09J125/14 ,  C09J133/16 ,  C09J183/06 ,  H01L21/683 ,  H01L21/306

CPC分类号： C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

摘要翻译： 通过用于生产包含（A）含有氟原子或硅原子的自由基聚合性单体或低聚物的半导体器件的临时粘合剂，（B）高分子化合物和（C）自由基聚合引发剂，用于生产 半导体装置，其涂布性优异，即使在待处理构件（例如半导体晶片）进行机械或化学处理时，即使在高温条件下也能够在临时支撑体中产生气体的问题 并且进一步地，其可以容易地释放所加工的构件的临时支撑件，而不会对经处理的高温处理的构件造成损害，并且提供粘合剂支撑件和使用其的半导体装置的制造方法。

公开(公告)号：US20140322893A1

公开(公告)日：2014-10-30

申请号：US14324626

申请日：2014-07-07

申请人： FUJIFILM CORPORATION

发明人： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC分类号： H01L23/00 ,  H01L21/683

CPC分类号： H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

摘要翻译： 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘合性的粘合剂层进行照射时的光化射线，辐射或加热以对所述粘合剂层进行照射 光化射线，辐射或热，将待处理部件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于被处理物体的第一表面的第二表面进行机械或化学处理 构件，以获得处理构件，并且从粘合剂支撑体的粘合剂层分离处理构件的第一表面，其中进行具有光化射线，辐射或热的粘合剂层的照射，使得粘附性朝向外表面减小 从粘合剂层的基板侧的内表面。

公开(公告)号：US20210165322A1

公开(公告)日：2021-06-03

申请号：US17169684

申请日：2021-02-08

申请人： FUJIFILM Corporation

发明人： Hiroshi SATO ,  Kazuhiro FUJIMAKI

IPC分类号： G03F7/033 ,  G03F7/20 ,  G03F7/00 ,  B41M1/04 ,  B41N1/12

摘要： An object of the present invention is to provide a water-developable flexographic printing plate precursor, a flexographic printing plate, and a photosensitive resin composition, which can maintain good water developability and can suppress adhesion and aggregation of dispersion in the developer in a case of repeated use and disposal of the aqueous developer. The water-developable flexographic printing plate precursor of the present invention is a water-developable flexographic printing plate precursor including a photosensitive layer, in which the photosensitive layer contains water-dispersible particles, and the water-dispersible particles have a core containing a polymer and having a glass transition temperature of 0° C. or lower and have a shell containing a polymer and having a glass transition temperature of 10° C. or higher.

公开(公告)号：US20160013088A1

公开(公告)日：2016-01-14

申请号：US14865755

申请日：2015-09-25

申请人： FUJIFILM Corporation

发明人： Ichiro KOYAMA ,  Yu IWAI ,  Kazuhiro FUJIMAKI

IPC分类号： H01L21/683 ,  C09J123/16 ,  H01L21/324 ,  C09J125/14

CPC分类号： H01L21/6835 ,  C09J4/00 ,  C09J123/16 ,  C09J125/14 ,  H01L21/324 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

摘要翻译： 提供了用于制造半导体器件的临时粘接层压板和半导体器件的制造方法。 待加工构件（半导体晶片等）可以在构件的机械或化学过程中被牢固且容易地暂时支撑，然后即使在经过处理的构件之后，处理构件也可以容易地从临时支撑件释放而不损坏处理构件 高温过程。 层压体包括：（A）剥离层和（B）粘合剂层。 剥离层含有（a1）在25℃恒温下加热条件下在氮气流中测定时，在25℃下为5％的质量还原温度为5 5％ ./min; 和（a2）在相同条件下测定时，具有250℃以上5％质量降低温度的粘合剂。

公开(公告)号：US20150184035A1

公开(公告)日：2015-07-02

申请号：US14658395

申请日：2015-03-16

申请人： FUJIFILM Corporation

发明人： Ichiro KOYAMA ,  Yu IWAI ,  Kazuhiro FUJIMAKI

IPC分类号： C09J7/02 ,  B32B37/12 ,  C09J145/00 ,  B32B38/10 ,  C09J125/06 ,  B32B37/18 ,  B32B38/00

CPC分类号： B32B37/12 ,  B32B37/18 ,  B32B38/0036 ,  B32B38/10 ,  B32B2457/14 ,  C09J5/00 ,  C09J5/06 ,  C09J7/401 ,  C09J125/06 ,  C09J145/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  C09J2423/005 ,  C09J2425/00 ,  C09J2425/005 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2839 ,  Y10T428/31844 ,  Y10T428/31938

摘要： As a temporary bonding layer for production of semiconductor device, which not only can temporarily support a member to be processed (for example, a semiconductor wafer) firmly and easily when the member to be processed is subjected to a mechanical or chemical processing, but also can easily release the temporary support for the member processed without imparting damage to the member processed, a stack and a production method of semiconductor device, a temporary bonding layer for production of semiconductor device including (A) a release layer and (B) an adhesive layer, wherein the release layer is a layer containing a hydrocarbon resin is provided.

摘要翻译： 作为用于制造半导体器件的临时接合层，其不仅可以在待加工构件经受机械或化学处理时，也可以牢固且容易地临时支撑待加工构件（例如，半导体晶片），而且还可以 可以容易地释放所加工的构件的临时支撑件，而不会对所加工的构件，堆叠和半导体装置的制造方法造成损害，用于制造半导体装置的临时粘合层包括（A）剥离层和（B）粘合剂 层，其中所述剥离层是包含烃树脂的层。

公开(公告)号：US20150093879A1

公开(公告)日：2015-04-02

申请号：US14567471

申请日：2014-12-11

申请人： FUJIFILM Corporation

发明人： Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA ,  Yu IWAI ,  Shiro TAN

IPC分类号： C09J7/02 ,  H01L21/302 ,  H01L21/683

CPC分类号： H01L21/302 ,  C09J7/20 ,  C09J7/38 ,  C09J133/02 ,  C09J133/12 ,  C09J161/06 ,  C09J175/14 ,  C09J175/16 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2475/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/13 ,  Y10T428/2852

摘要： The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

摘要翻译： 本发明涉及一种用于生产半导体器件的临时粘合剂，其包含（A）具有酸基的聚合物化合物，（B）稀释剂，和（C）溶剂，包含基底的粘合剂载体和形成的粘合剂层 从半导体装置的制造用临时粘合剂和具有加工部件的半导体装置的制造方法，其特征在于，包括：通过由用于制造半导体装置的临时粘合剂形成的粘合剂层将待加工的部件的第一表面粘附到基板上 如所要求的; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。

公开(公告)号：US20160075922A1

公开(公告)日：2016-03-17

申请号：US14953697

申请日：2015-11-30

申请人： FUJIFILM Corporation

发明人： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC分类号： C09J151/00 ,  H01L21/683

CPC分类号： C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

公开(公告)号：US20150184033A1

公开(公告)日：2015-07-02

申请号：US14660244

申请日：2015-03-17

申请人： FUJIFILM Corporation

发明人： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA

IPC分类号： C09J4/00 ,  C09J7/02 ,  H01L21/683 ,  H01L21/304 ,  H01L21/306

CPC分类号： C09J4/00 ,  C08F222/10 ,  C09J4/06 ,  C09J7/00 ,  C09J7/385 ,  C09J133/06 ,  C09J2203/326 ,  C09J2400/22 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

摘要翻译： 本发明涉及一种临时粘合剂，其包含（A）在侧链具有自由基聚合性基团的高分子化合物，（B）自由基聚合性单体和（C）热自由基聚合引发剂，以及半导体装置的制造方法 其特征在于，包括：通过由所述临时粘合剂形成的粘合剂层将待加工的构件的第一表面粘附到基底; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。

公开(公告)号：US20140318697A1

公开(公告)日：2014-10-30

申请号：US14328191

申请日：2014-07-10

申请人： FUJIFILM Corporation

发明人： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Atsushi NAKAMURA ,  Yu IWAI ,  Ichiro KOYAMA

IPC分类号： H01L21/673

CPC分类号： H01L21/673 ,  C09J5/04 ,  C09J7/22 ,  C09J7/35 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray or radiation to pattern exposure of the adhesive layer to provide a high adhesive region and a low adhesive region in the adhesive layer, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching the first surface of the treated member from the adhesive layer of the adhesive support.

摘要翻译： 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘附性的粘合剂层进行照射时，用光化射线或辐射照射粘合剂层以图案曝光， 高粘合剂区域和粘合剂层中的低粘合剂区域，将被处理构件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于第一表面的第二表面施加机械或化学处理 待处理的构件以获得处理的构件，并且将所处理的构件的第一表面从粘合剂支撑体的粘合剂层分离。