公开(公告)号：US20230213858A1

公开(公告)日：2023-07-06

申请号：US18184697

申请日：2023-03-16

Applicant: FUJIFILM Corporation

Inventor： Misaki TAKASHIMA ,  Kazuto SHIMADA ,  Atsuyasu NOZAKI ,  Naoki SATO

IPC: G03F7/038 ,  G03F7/42 ,  G03F7/32 ,  C08G73/10 ,  C08G73/22 ,  H01L21/027

CPC classification number: G03F7/0387 ,  G03F7/422 ,  G03F7/32 ,  C08G73/10 ,  C08G73/22 ,  H01L21/0274

Abstract: A manufacturing method for a cured substance includes a film forming step of applying a specific photosensitive resin composition onto a base material to form a film, an exposure step of selectively exposing the film, a development step of developing the exposed film with a developer to form a pattern, a treatment step of bringing a treatment liquid into contact with the pattern, and a heating step of heating the pattern after the treatment step, in which at least one of the developer or the treatment liquid contains at least one compound selected from the group consisting of a base and a base generator.

公开(公告)号：US20230350305A1

公开(公告)日：2023-11-02

申请号：US18337442

申请日：2023-06-20

Applicant: FUJIFILM Corporation

Inventor： Atsuyasu NOZAKI ,  Misaki TAKASHIMA ,  Naoki SATO ,  Atsushi NAKAMURA

IPC: G03F7/30 ,  G03F7/20 ,  H01L21/027 ,  G03F7/40 ,  G03F7/038 ,  G03F7/32

CPC classification number: G03F7/3057 ,  G03F7/2051 ,  H01L21/0275 ,  G03F7/40 ,  G03F7/0387 ,  G03F7/327

Abstract: There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance.
The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.