公开(公告)号：US20140193573A1

公开(公告)日：2014-07-10

申请号：US14206615

申请日：2014-03-12

Applicant: FUJIKURA LTD. ,  UNIVERSITY OF YAMANASHI

Inventor： Eiichi KONDOH ,  Masahiro MATSUBARA ,  Yuto TAKEUCHI ,  Mitsuhiro WATANABE ,  Satoshi YAMAMOTO ,  Naohiro KIKUKAWA

IPC: C23C18/40 ,  C23C18/31

CPC classification number: C23C18/40 ,  C23C18/1603 ,  C23C18/1619 ,  C23C18/1685 ,  C23C18/31 ,  H01L21/283 ,  H01L21/76898

Abstract: An apparatus forms an electroconductive substance in micro holes, the apparatus introduces a fluid, that includes at least a metal complex dissolved in a supercritical fluid or a subcritical fluid, into a reaction chamber including a first space and a second space, allows a planar substrate to be disposed in the fluid that continuously moves in a specific direction in the reaction chamber. A second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves; the substrate is supported throughout the entire first surface so that the fluid travels in the micro holes of the substrate from the second surface toward the first space of the substrate; and a support member including a fine communication hole through which the fluid passes toward the second space is disposed.

Abstract translation: 一种装置在微孔中形成导电物质，该装置将包含至少一种溶解在超临界流体或亚临界流体中的金属络合物的流体引入到包括第一空间和第二空间的反应室中，允许平面基板 被布置在反应室中沿特定方向连续移动的流体中。 衬底的第二表面垂直于引入第一空间的流体移动的特定方向; 衬底被支撑在整个整个第一表面上，使得流体在衬底的微孔中从衬底的第二表面朝向衬底的第一空间行进; 并且设置有包括流体朝向第二空间通过的微细连通孔的支撑构件。