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公开(公告)号：US20200173730A1
公开(公告)日：2020-06-04
申请号：US16779146
申请日：2020-01-31
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke WATANABE , Tatsuro MIURA , Toshiaki NAKAMURA , Kenya KAWABATA , Yoshikatsu INAGAKI
Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.The heat sink includes: a heat transport member having a heat receiving portion thermally connected to a heat-generating element and including a first wick structure; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member and including a second wick structure; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which, the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, the internal space of the heat transport member communicating with an internal space of the tube body, and the first wick structure includes a branch portion branched in a thickness direction of the heat transport member and multi-stage stem parts extending from the branch portion in a predetermined direction.
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公开(公告)号：US20200149823A1
公开(公告)日：2020-05-14
申请号：US16677160
申请日：2019-11-07
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kenya KAWABATA , Yoshikatsu INAGAKI
Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases. A heat pipe including: a container having a tubular shape in which an end surface of one end part and an end surface of another end part are sealed, the container including an inner wall surface in which a groove part is formed; a sintered body layer provided on the inner wall surface of the container, the sintered body layer being formed by sintering a powder; and a working fluid sealed in a hollow part of the container, wherein: the sintered body layer includes a first sintered part located in an evaporation part of the heat pipe, and a second sintered part located in a heat insulation part between the evaporation part and a condensation part of the heat pipe, the second sintered part being continuous with the first sintered part, and a capillary force of the first sintered part is larger than a capillary force of the second sintered part.
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公开(公告)号：US20200025460A1
公开(公告)日：2020-01-23
申请号：US16586799
申请日：2019-09-27
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Hirofumi AOKI , Yoshikatsu INAGAKI , Kenya KAWABATA , Hiroshi OKADA , Daiki TAKEMURA
IPC: F28D15/02
Abstract: The present disclosure is related to providing a heat sink that exhibits an excellent cooling performance by preventing occurrence of a hot spot on a heat pipe. A heat sink comprising: a heat receiving plate to which a heating element is thermally connected; and a heat pipe thermally connected to the heat receiving plate, wherein a thermal conductivity of the heat receiving plate is higher than a thermal conductivity of a material of a container of the heat pipe.
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公开(公告)号：US20220128314A1
公开(公告)日：2022-04-28
申请号：US17571432
申请日：2022-01-07
Applicant: Furukawa Electric Co., Ltd.
Inventor： Yoshikatsu INAGAKI , Kenya KAWABATA , Hirofumi AOKI
IPC: F28D15/04
Abstract: The disclosure provides a vapor chamber that has excellent fixing stability of a wick structure inside a container and also has excellent circulation properties for a liquid-phase working fluid due to excellent capillary force of the wick structure. The vapor chamber includes a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity portion, and a wick structure contained in the cavity portion and welded to the container so that a welded portion is formed in the wick structure.
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公开(公告)号：US20210318072A1
公开(公告)日：2021-10-14
申请号：US17355647
申请日：2021-06-23
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Shinichi ITO , Masahiro MEGURO , Kenya KAWABATA , Yoshikatsu INAGAKI
Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
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Patent Agency Ranking
公开(公告)号：US20180128552A1
公开(公告)日：2018-05-10
申请号：US15866688
申请日：2018-01-10
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Shinichi ITO , Masahiro MEGURO , Kenya KAWABATA
Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
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公开(公告)号：US20220132697A1
公开(公告)日：2022-04-28
申请号：US17571407
申请日：2022-01-07
Applicant: Furukawa Electric Co., Ltd.
Inventor： Yoshikatsu INAGAKI , Kenya KAWABATA , Hirofumi AOKI
Abstract: A vapor chamber is provided that allows space-saving and weight reduction of a device in which the vapor chamber is to be mounted. The vapor chamber has a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, and a working fluid enclosed in the cavity portion. The container includes a heat transfer portion that transfers heat by a phase change of the working fluid, and an extending portion that extends outwards from the heat transfer portion and has a function other than a heat transfer function.
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公开(公告)号：US20210022265A1
公开(公告)日：2021-01-21
申请号：US17061468
申请日：2020-10-01
Applicant: Furukawa Electric Co., Ltd.
Inventor： Yoshikatsu INAGAKI , Hirofumi AOKI , Hiroshi OKADA , Kenya KAWABATA , Tomoaki TORATANI
IPC: H05K7/20
Abstract: The present disclosure provides a cooling device that can exhibit excellent cooling characteristics while avoiding increase in size of the device, and a cooling system using the cooling device. The cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant sealed in an inside of the container, and a condensation tube through which a secondary refrigerant flows, and which penetrates through a gaseous phase portion inside of the container.
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公开(公告)号：US20210007246A1
公开(公告)日：2021-01-07
申请号：US17027182
申请日：2020-09-21
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke WATANABE , Kenya KAWABATA , Yoshikatsu INAGAKI , Tatsuro MIURA , Kazuaki AOTANI , Toshiaki NAKAMURA
IPC: H05K7/20
Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.
A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is thermally connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, and a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is larger than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion.-
公开(公告)号：US20200173731A1
公开(公告)日：2020-06-04
申请号：US16779286
申请日：2020-01-31
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kenya KAWABATA , Yasumi SASAKI , Yosuke WATANABE
Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.There is provided a heat sink including: a heat transport member having a heat receiving portion thermally connected to a heat-generating element; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, and the internal space of the heat transport member communicates with an internal space of the tube body.
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