COOLING DEVICE WITH SUPERIMPOSED FIN GROUPS

    公开(公告)号:US20210318072A1

    公开(公告)日:2021-10-14

    申请号:US17355647

    申请日:2021-06-23

    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.

    COOLING DEVICE
    4.
    发明申请
    COOLING DEVICE 审中-公开

    公开(公告)号:US20180128552A1

    公开(公告)日:2018-05-10

    申请号:US15866688

    申请日:2018-01-10

    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

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