公开(公告)号：US20240106189A1

公开(公告)日：2024-03-28

申请号：US18534857

申请日：2023-12-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yasumasa KAWAKITA ,  Masakazu MIURA ,  Hirotatsu ISHII ,  Tetsuya TAKEUCHI

IPC: H01S5/023 ,  H01S5/02345

CPC classification number: H01S5/023 ,  H01S5/02345

Abstract: A chip on submount includes: a submount including a first surface directed in a first direction; a covering layer mounted on the first surface, extending to intersect the first direction, and including a second surface directed in the first direction; a laser element mounted on the second surface and including: a third surface directed in the first direction; and a light emission unit positioned at an intermediate portion of the laser element along a second direction intersecting the first direction, extending in a third direction intersecting the first direction and second direction, and configured to output laser light in the third direction; and a bonding wire attached onto the third surface and configured to exert a pressing force on the laser element, the pressing force including a component force directed in a direction opposite to the first direction.