OPTICAL PROCESSING STRUCTURE OF OPTICAL FIBER

    公开(公告)号:US20220003950A1

    公开(公告)日:2022-01-06

    申请号:US17479269

    申请日:2021-09-20

    Abstract: An optical processing structure of an optical fiber, includes: an optical fiber that includes a core, a cladding, and a coating, the coating being partially removed; and a thermally conductive protective material made of a silicone-based thermally conductive compound and provided around the cladding in a coating removed region of the optical fiber. Further, the thermally conductive protective material contains a filler having a refractive index higher than a refractive index of the cladding, and the filler is present in a region where evanescent light seeping out of the cladding is present when cladding mode light propagating in the cladding is totally reflected.

    CHIP ON SUBMOUNT
    4.
    发明公开
    CHIP ON SUBMOUNT 审中-公开

    公开(公告)号:US20240106189A1

    公开(公告)日:2024-03-28

    申请号:US18534857

    申请日:2023-12-11

    CPC classification number: H01S5/023 H01S5/02345

    Abstract: A chip on submount includes: a submount including a first surface directed in a first direction; a covering layer mounted on the first surface, extending to intersect the first direction, and including a second surface directed in the first direction; a laser element mounted on the second surface and including: a third surface directed in the first direction; and a light emission unit positioned at an intermediate portion of the laser element along a second direction intersecting the first direction, extending in a third direction intersecting the first direction and second direction, and configured to output laser light in the third direction; and a bonding wire attached onto the third surface and configured to exert a pressing force on the laser element, the pressing force including a component force directed in a direction opposite to the first direction.

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