Abstract:
A semiconductor device includes a semiconductor layer formed of a III-V group semiconductor crystal containing As as a primary component of a V group. A V group element other than As has been introduced at a concentration of 0.02 to 5% into a V group site of the III-V group semiconductor crystal in the semiconductor layer.
Abstract:
A semiconductor laser device includes an active layer including a well layer and a barrier layer formed of a III-V group semiconductor crystal containing As as a primary component of a V group. A V group element other than As has been introduced at a concentration of 0.02 to 5% into a V group site of the III-V group semiconductor crystal in at least one of the well layer and the barrier layer, and a III group site of the III-V group semiconductor crystal in at least one of the well layer and the barrier layer contains Al.
Abstract:
An optical processing structure of an optical fiber, includes: an optical fiber that includes a core, a cladding, and a coating, the coating being partially removed; and a thermally conductive protective material made of a silicone-based thermally conductive compound and provided around the cladding in a coating removed region of the optical fiber. Further, the thermally conductive protective material contains a filler having a refractive index higher than a refractive index of the cladding, and the filler is present in a region where evanescent light seeping out of the cladding is present when cladding mode light propagating in the cladding is totally reflected.
Abstract:
A chip on submount includes: a submount including a first surface directed in a first direction; a covering layer mounted on the first surface, extending to intersect the first direction, and including a second surface directed in the first direction; a laser element mounted on the second surface and including: a third surface directed in the first direction; and a light emission unit positioned at an intermediate portion of the laser element along a second direction intersecting the first direction, extending in a third direction intersecting the first direction and second direction, and configured to output laser light in the third direction; and a bonding wire attached onto the third surface and configured to exert a pressing force on the laser element, the pressing force including a component force directed in a direction opposite to the first direction.
Abstract:
Included are: an active layer provided between an upper multilayer film reflecting mirror and a lower multilayer film reflecting mirror formed on a GaAs substrate and formed of a periodic structure of a low-refractive-index layer formed of AlxGa1-xAs (0.8≦x≦1) and a high-refractive-index layer formed of AlyGa1-yAs (0≦y≦x), at least one of the low-refractive-index layer and the high-refractive-index layer being of n-type; and a lower electrode provided between the lower multilayer film reflecting mirror and the active layer and configured to inject an electric current into the active layer.
Abstract translation:包括:在上层多层膜反射镜和形成在GaAs衬底上的下层多层膜反射镜之间形成的有源层,其由Al x Ga 1-x As(0.8 @ x @ x As)形成的低折射率层的周期性结构形成, 1)和由AlyGa1-yAs(0 @ y @ x)形成的高折射率层,低折射率层和高折射率层中的至少一个为n型; 以及下电极,设置在所述下多层膜反射镜和所述有源层之间,并且被配置为向所述有源层注入电流。