摘要:
Alignment targets include optically resolvable regions and SEM resolvable regions. SEM measurements taken of the SEM resolvable regions produce correction factors that can be applied to optical measurements taken of the optically resolvable regions where the correction factors improve the accuracy of the optical measurements. When one or more batches of wafers from a continuous production run are to be measured, a small sub-sample is measured with use of an SEM scan of their SEM resolvable regions. Then the correction factors developed from the SEM scans are applied to optical measurements taken of others of the wafers in the same mass production run.