公开(公告)号：US20210150175A1

公开(公告)日：2021-05-20

申请号：US17161963

申请日：2021-01-29

Applicant: Fingerprint Cards AB

Inventor： Nils LUNDBERG ,  Zhimin MO ,  Mats SLOTTNER

IPC: G06K9/00 ,  G06K9/20 ,  G06K19/073

Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

公开(公告)号：US20190340406A1

公开(公告)日：2019-11-07

申请号：US16512845

申请日：2019-07-16

Applicant: Fingerprint Cards AB

Inventor： Nils LUNDBERG ,  Zhimin MO ,  Mats SLOTTNER

IPC: G06K9/00 ,  G06K19/073

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

公开(公告)号：US20180174018A1

公开(公告)日：2018-06-21

申请号：US15807679

申请日：2017-11-09

Applicant: Fingerprint Cards AB

Inventor： Nils LUNDBERG ,  Zhimin MO ,  Mats SLOTTNER

IPC: G06K19/14 ,  G06K9/00 ,  G06K19/18 ,  G06K19/077

CPC classification number: G06K19/145 ,  G06K9/0002 ,  G06K9/00053 ,  G06K19/07701 ,  G06K19/0772 ,  G06K19/18

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.