公开(公告)号：US20040151505A1

公开(公告)日：2004-08-05

申请号：US10748051

申请日：2003-12-30

Applicant: Finisar Corporation

Inventor： Lewis B. Aronson ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Dev E. Kumar ,  T.G. Beck Mason

IPC: H02G003/08 ,  H01J005/00 ,  H05K005/00 ,  H01J015/00

CPC classification number: H01S5/02212 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02415 ,  H01L2924/00

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract translation: 采用外部调制激光器（EML）的小尺寸收发模块。 收发器模块具有发射器光学子组件，其具有头部组件，该头部组件具有带有延伸穿过的平台的底座。 平台具有延伸穿过平台的多个导电迹线，用于在基底的两侧进行连接。 热电冷却器（TEC）用于从头部组件内的激光器散热。 TEC充分散热，使EML能够用于头部组件。 以这种方式，EML可用于相对较小的光学装置，包括符合XFP标准的小尺寸收发器。 具有EML的XFP模块可用于比没有EML的XFP更长的链路。 此外，EML可以使用TEC进行稳定，以便XFP模块可用于DWDM型应用。