LED lighting unit
    1.
    发明授权
    LED lighting unit 有权
    LED照明单元

    公开(公告)号:US09523494B2

    公开(公告)日:2016-12-20

    申请号:US14623879

    申请日:2015-02-17

    发明人: Earl James Hayes

    摘要: An LED lighting unit may include a flexible circuit substrate having a an obverse side and a reverse side. The obverse side may include a plurality of mounting points for LEDs and the reverse side may include a thermal conduction material. A plurality of LEDs may be mounted to the plurality of mounting points and may be in thermal communication with the thermal conduction material. A heat sink may be attached to the reverse side of the substrate and may have a hollow conical-frustum geometry. The heat sink may include a top circumference, a bottom circumference, a top opening, a bottom opening, at least one cooling fin extending into an interior of the heat sink.

    摘要翻译: LED照明单元可以包括具有正面和反面的柔性电路基板。 正面可以包括用于LED的多个安装点,并且反面可以包括导热材料。 多个LED可以安装到多个安装点并且可以与导热材料热连通。 散热器可以附接到基板的相反侧,并且可以具有中空的圆锥台形几何形状。 散热器可以包括顶部圆周,底部圆周,顶部开口,底部开口,延伸到散热器内部的至少一个冷却翅片。

    LED LIGHTING UNIT
    2.
    发明申请
    LED LIGHTING UNIT 有权
    LED灯具

    公开(公告)号:US20160238231A1

    公开(公告)日:2016-08-18

    申请号:US14623879

    申请日:2015-02-17

    发明人: Earl James Hayes

    IPC分类号: F21V29/77 F21V19/00

    摘要: An LED lighting unit may include a flexible circuit substrate having a an obverse side and a reverse side. The obverse side may include a plurality of mounting points for LEDs and the reverse side may include a thermal conduction material. A plurality of LEDs may be mounted to the plurality of mounting points and may be in thermal communication with the thermal conduction material. A heat sink may be attached to the reverse side of the substrate and may have a hollow conical-frustum geometry. The heat sink may include a top circumference, a bottom circumference, a top opening, a bottom opening, at least one cooling fin extending into an interior of the heat sink.

    摘要翻译: LED照明单元可以包括具有正面和反面的柔性电路基板。 正面可以包括用于LED的多个安装点,并且反面可以包括导热材料。 多个LED可以安装到多个安装点并且可以与导热材料热连通。 散热器可以附接到基板的相反侧,并且可以具有中空的圆锥台形几何形状。 散热器可以包括顶部圆周,底部圆周,顶部开口,底部开口,延伸到散热器内部的至少一个冷却翅片。