公开(公告)号：US20040247920A1

公开(公告)日：2004-12-09

申请号：US10456343

申请日：2003-06-06

Applicant: FormFactor, Inc.

Inventor： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

IPC: H01F003/00 ,  B05B001/00 ,  C09D005/00 ,  C25D003/00

CPC classification number: C25D3/54 ,  Y10T428/12 ,  Y10T428/24612 ,  Y10T428/265

Abstract: A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

Abstract translation: 将卤化物基应力降低剂加入到镀铑溶液的浴中。 减压剂可减少电镀铑中的应力，增加可镀而不开裂的铑的厚度。 此外，应力降低剂不会显着降低镀覆铑的耐磨性或硬度。