公开(公告)号：US20030237061A1

公开(公告)日：2003-12-25

申请号：US10177367

申请日：2002-06-19

Applicant: FormFactor, Inc.

Inventor： Charles A. Miller ,  Timothy Cooper ,  Yoshikazu Hatsukano

IPC: G06F017/50 ,  H01L029/40

CPC classification number: G11C29/56 ,  G01R31/2831 ,  G01R31/2886 ,  G01R31/31718 ,  G11C29/006 ,  G11C29/56016

Abstract: A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermined positions relative to landmarks on the carrier base the die pick machine optically identifies. With the dice temporarily held in place on the carrier base, they are subjected to a series of testing and other processing steps. Since each die's signal pads reside in predetermined locations, they can be accessed by appropriately arranged probes providing test equipment with signal access to the pads during tests. After each test, a die pick machine may replace any die that fails the test with another die, thereby improving efficiency of subsequent testing and other processing resources.

Abstract translation: 切割半导体晶片以对形成在晶片上的集成电路芯片进行分割。 然后，骰子拾取机器将分离的骰子定位和定位在载体基座上，使得形成在每个模具表面上的信号，功率和接地垫相对于骰子拾取机器光学识别的载体基座上的标志位于预定位置。 将骰子临时固定在承运人基地上，对其进行一系列测试和其他处理步骤。 由于每个管芯的信号焊盘都位于预定位置，所以它们可以通过适当布置的探头进行访问，从而在测试期间为测试设备提供对焊盘的信号访问。 在每次测试之后，模具拾取机器可以用另一个模具代替未测试的任何模具，从而提高后续测试和其他处理资源的效率。