CONDUCTIVE FABRIC AND ITS PREPARATION AND APPLICATIONS

    公开(公告)号:US20210120634A1

    公开(公告)日:2021-04-22

    申请号:US17072337

    申请日:2020-10-16

    IPC分类号: H05B3/34 H05K1/03 H05K3/18

    摘要: The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.