Process of depositing a coating onto a substrate by reactive sputtering
    2.
    发明授权
    Process of depositing a coating onto a substrate by reactive sputtering 失效
    通过反应溅射将涂层沉积到基底上的过程

    公开(公告)号:US06485615B1

    公开(公告)日:2002-11-26

    申请号:US08225942

    申请日:1994-04-11

    IPC分类号: C23C1434

    摘要: A process of depositing a coating (5) onto a substrate (3) by reactive sputtering in a closed chamber (1) in the presence of a plasma of a non-reactive gas, and a reactive gas containing the element or elements said coating has to be made of, according to which process use is made of a target (2) having a surface layer (4) directed towards the substrate and containing at least one of the elements to be sputter deposited onto this substrate, according to which process the thickness of said surface layer (4) during the cathode sputtering is controlled by adjusting the concentration of the gases in said closed chamber (1). The single figure.

    摘要翻译: 在非反应性气体的等离子体存在下,在封闭室(1)中反应溅射将涂层(5)沉积到衬底(3)上的过程以及包含所述元件或所述涂层的反应性气体的方法具有 根据哪个方法制成具有指向基板的表面层(4)的目标(2),并且包含要溅射沉积到该基板上的至少一个元素,根据该方法, 通过调节所述封闭室(1)中的气体浓度来控制阴极溅射期间所述表面层(4)的厚度。 单身人士。