公开(公告)号：US09037279B2

公开(公告)日：2015-05-19

申请号：US12831597

申请日：2010-07-07

申请人： Francis Ko ,  Tzu-yu Wang ,  Kewei Zuo ,  Henry Lo ,  Jean Wang ,  Chih-Wei Lai

发明人： Francis Ko ,  Tzu-yu Wang ,  Kewei Zuo ,  Henry Lo ,  Jean Wang ,  Chih-Wei Lai

IPC分类号： G06F19/00 ,  H01L21/00 ,  G05B17/02

CPC分类号： G05B19/41885 ,  G05B17/02 ,  G05B2219/45032

摘要： A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route.

摘要翻译： 第一实施例是一种用于半导体处理控制的方法，其包括基于处理数据将处理级的处理工具集群到工具集群中，并且基于工具集群形成用于处理半导体晶片的预测模型。 第二实施例是一种用于半导体处理控制的方法，包括提供第一级工具集群和第二级工具集群之间的集群路由，为每个集群路由分配比较优化等级，以及调度晶片的处理。 比较优化排名确定了哪些集群路由提供高晶圆处理均匀性。 此外，需要高晶圆处理均匀性的晶片被调度为沿着具有高比较优化等级的一个集群路由进行处理，该优先等级标识一个集群路由以具有最高的晶片处理均匀性，并且不需要高晶片处理均匀性的晶片是 计划沿着另一个集群路由处理。