Tiled manifold for a page wide printhead
    1.
    发明授权
    Tiled manifold for a page wide printhead 有权
    平铺歧管用于页面宽的打印头

    公开(公告)号:US08313167B2

    公开(公告)日:2012-11-20

    申请号:US12568739

    申请日:2009-09-29

    IPC分类号: B41J2/155

    摘要: An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.

    摘要翻译: 一种油墨歧管,其构造有多个半导体瓦片,该半导体瓦片端接到端部固定在刚性基座构件上以形成页宽打印机构。 每个瓦片由一侧的墨水通道构成,与相对侧的墨水出口端口液体连通。 墨水通道将墨水从基底构件中的端口携带到瓦片的出口。 每个瓦片之间的界面定义了边界。 喷墨打印头被紧固在平铺歧管的每个边界上,使得打印头的墨水入口与底层瓦片的墨水出口对准。 没有油墨穿过相邻歧管瓦片的边界。 在制造页宽打印机构时,从半导体晶片制造各个瓦片有利于晶片的使用。

    Ink jetting structure having protected connections
    4.
    发明授权
    Ink jetting structure having protected connections 有权
    具有受保护连接的喷墨结构

    公开(公告)号:US07784909B2

    公开(公告)日:2010-08-31

    申请号:US12021375

    申请日:2008-01-29

    IPC分类号: B41J2/14

    CPC分类号: B41J2/17553 B41J2/17526

    摘要: An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

    摘要翻译: 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面,并且包括第一组电触头。 打印头电路构件具有第三表面,第四表面和开口,其构造成接收加热器芯片,加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点,并且电连接到柔性电缆,用于耦合到打印机上的相应触点。

    INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS
    8.
    发明申请
    INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS 有权
    具有保护连接的墨水喷射结构

    公开(公告)号:US20090189954A1

    公开(公告)日:2009-07-30

    申请号:US12021375

    申请日:2008-01-29

    IPC分类号: B41J2/01

    CPC分类号: B41J2/17553 B41J2/17526

    摘要: An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

    摘要翻译: 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面,并且包括第一组电触头。 打印头电路构件具有第三表面,第四表面和开口,其构造成接收加热器芯片,加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点,并且电连接到柔性电缆,用于耦合到打印机上的相应触点。