公开(公告)号：US06770377B2

公开(公告)日：2004-08-03

申请号：US10170852

申请日：2002-06-12

申请人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Anobecs Allo ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

发明人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Anobecs Allo ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

IPC分类号： C22C1600

CPC分类号： B23K35/32 ,  B22F9/023 ,  C04B37/006 ,  C04B2237/122 ,  C04B2237/127 ,  C04B2237/343

摘要： The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.

摘要翻译： 用于钎焊氧化铝陶瓷部件，特别是高纯度氧化铝的活性钎焊焊料最多含有12wt。 ％Ti，最多8wt。 ％Be，小于16.5wt。 ％Fe，其余为Zr和可能存在的任何杂质。 活性钎焊焊料具有以下特点：钎焊温度低于1000℃。 钎焊接头长时间高真空密封; 活性钎焊合金的热膨胀系数在钎焊过程中覆盖的整个温度范围内基本上与氧化铝陶瓷的热膨胀系数相同; 两个陶瓷部件之间的钎焊接头的强度如此之高，以至于在拉伸载荷下，不会在接头处产生断裂，而是在相邻的陶瓷中产生断裂; 活性钎焊焊料的耐压大于2 GPa; 活性钎焊焊料可以非常好地加工成具有10um数量级的粒度的粉末。

公开(公告)号：US06427900B1

公开(公告)日：2002-08-06

申请号：US09455690

申请日：1999-12-07

申请人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Andreas Otto ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

发明人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Andreas Otto ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

IPC分类号： B23K3102

CPC分类号： B23K35/32 ,  B22F9/023 ,  C04B37/006 ,  C04B2237/122 ,  C04B2237/127 ,  C04B2237/343

摘要： The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.

摘要翻译： 用于钎焊氧化铝陶瓷部件，特别是高纯度氧化铝的活性钎焊焊料最多含有12wt。 ％Ti，最多8wt。 ％Be，小于16.5wt。 ％Fe，其余为Zr和可能存在的任何杂质。 活性钎焊焊料具有以下特点：钎焊温度低于1000℃。 钎焊接头长时间高真空密封; 活性钎焊合金的热膨胀系数在钎焊过程中覆盖的整个温度范围内基本上与氧化铝陶瓷的热膨胀系数相同; 两个陶瓷部件之间的钎焊接头的强度如此之高，以至于在拉伸载荷下，不会在接头处产生断裂，而是在相邻的陶瓷中产生断裂; 活性钎焊焊料的耐压大于2 GPa; 活性钎焊焊料可以非常好地加工成具有10um数量级的粒度的粉末。