公开(公告)号：US5910334A

公开(公告)日：1999-06-08

申请号：US991685

申请日：1997-12-16

申请人： Frans Peter Lautzenhiser ,  John Karl Isenberg ,  James Edward Walsh ,  Adam Wade Schubring

发明人： Frans Peter Lautzenhiser ,  John Karl Isenberg ,  James Edward Walsh ,  Adam Wade Schubring

IPC分类号： H01L21/48 ,  H05K3/46 ,  B05D5/12

CPC分类号： H01L21/4867 ,  H01L21/4857 ,  H05K3/4664 ,  Y10T29/49144

摘要： An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features. The thicker dielectric layer provides improved isolation between circuit layers, and the smaller dielectric features increase the available surface area for conductors and components on the upper dielectric layer. Additionally, process robustness is improved, since there is less fine tuning and batch-to-batch variation when used in high volume production.

摘要翻译： 一种改进的制造多层厚膜电路的方法，其有效地消除了厚度和清晰度之间的折衷，允许没有针孔的厚度增加的电介质层，并且同时更精确地定义介电特征，例如 通过开口和焊料停止。 电介质特征由介电材料的初始薄层精确定义，称为特征定义印刷或FDP。 在FDP已经干燥但尚未被烧制之后，可以通过印刷相当厚的电介质覆盖层来形成通孔，从而重新研磨FDP的边缘。 由于干燥但未燃烧的FDP的多孔性质，其吸收介电覆盖层的溶剂，这阻止了介电覆盖层的扩展。 然后，FDP与第一电介质层共烧，并且如果需要，可以在烧制的第一层的顶部设置第二介电层，以进一步增加整个电介质厚度。 这导致用于相同数量的连续印刷步骤的较厚的介电层，并且同时具有更小的电介质特征。 较厚的电介质层提供了电路层之间的改进的隔离，较小的电介质特征增加了上电介质层上的导体和部件的可用表面积。 此外，改进了工艺稳定性，因为当用于大批量生产时，微调和批批差异较少。

公开(公告)号：US6143355A

公开(公告)日：2000-11-07

申请号：US251248

申请日：1999-02-16

申请人： James Edward Walsh ,  John Karl Isenberg ,  Frans Peter Lautzenhiser

发明人： James Edward Walsh ,  John Karl Isenberg ,  Frans Peter Lautzenhiser

IPC分类号： H05K1/02 ,  H05K3/12 ,  B05D5/12

CPC分类号： H05K1/0268 ,  H05K3/12 ,  H05K2201/09781 ,  H05K2203/166

摘要： An improved method of making a multiple print thick film circuit wherein the alignment between successive conductor print steps is both optically inspectable and electrically testable. The first of two or more successive conductor print layers includes a pair of adjacent alignment features with a non-conductive gap therebetween, and the successive conductor print layer includes a pair of identical alignment features which are printed directly on top of the alignment feature pair of the first print layer. When the successive print layer is properly aligned with the first print layer, the non-conductive gap between the alignment features of the first print layer will be preserved, and test probes brought into contact with the features or associated probe pads will reveal a high or open-circuit impedance therebetween. If the successive print layer is mis-aligned relative to the first print layer, one or more of its alignment feature segments or surfaces will bridge the non-conductive gap between the alignment features of the first print layer, and test probes brought into contact with the features or associated probe pads will reveal a low or short-circuit impedance therebetween. Additionally or alternatively, the gap between adjacent alignment features may be optically inspected.

摘要翻译： 一种制造多重印刷厚膜电路的改进方法，其中连续导体印刷步骤之间的对准既可光学检查，也可电学测试。 两个或更多个连续的导体印刷层中的第一个包括一对相邻的对准特征，其间具有非导电间隙，并且连续的导体印刷层包括一对相同的对准特征，其直接印刷在对准特征对的顶部上 第一印刷层。 当连续印刷层与第一印刷层正确对准时，第一印刷层的对准特征之间的非导电间隙将被保留，并且与特征或相关联的探针垫接触的测试探针将显示高或 它们之间的开路阻抗。 如果相继的印刷层相对于第一印刷层错位，则其一个或多个对准特征段或表面将桥接第一印刷层的对准特征之间的非导电间隙，以及与 特征或相关的探针焊盘将在其间显示低或短路阻抗。 附加地或替代地，可以光学检查相邻对准特征之间的间隙。

公开(公告)号：US6007867A

公开(公告)日：1999-12-28

申请号：US106788

申请日：1998-06-29

申请人： James Edward Walsh ,  Carl William Berlin ,  Frans Peter Lautzenhiser ,  John Karl Isenberg

发明人： James Edward Walsh ,  Carl William Berlin ,  Frans Peter Lautzenhiser ,  John Karl Isenberg

IPC分类号： H01L21/48 ,  H05K3/46 ,  B05D5/12

CPC分类号： H01L21/4867 ,  H01L21/4857 ,  H05K3/4664 ,  Y10T29/49144

摘要： An improved method of manufacturing thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The method utilizes a dielectric material that can be co-fired with an underlying conductor, and preferably, that remains porous after firing. A layer of the dielectric material (FDL) is printed atop a dried but not yet fired conductor of the first circuit layer, and then co-fired with the conductor. Spreading of the FDL prior to firing is minimized due to the porosity of the dried but unfired conductor, which absorbs solvent from the FDL. The FDL can be printed in a ring, enclosing a portion of the underlying conductor to form a via definition ring, or VDR. After the FDL and conductor have been co-fired, a relatively thick cover layer of conventional dielectric material is printed over the first circuit layer, partially over-lapping the fired VDR. Again, spreading of the cover layer of dielectric is minimized, this time due to the porosity of the fired VDR, which absorbs solvent from the cover layer dielectric. The cover layer dielectric is then fired, and a second cover layer of conventional dielectric is printed atop the first cover layer to achieve the desired overall dielectric thickness. Spreading of the second cover layer is also inhibited by the fired VDR, resulting in a via with greatly improved definition compared to previously known processes. Alternatively, the FDL can be printed atop a dried but un-fired conductor and then co-fired with the conductor to form a solder stop with significantly improved feature definition. As with the via, the improved definition occurs because the porous un-fired conductor inhibits spreading of the FDL.

摘要翻译： 一种改进的制造厚膜电路的方法，其有效地消除了厚度和清晰度之间的折衷，允许没有针孔的厚度增加的电介质层，同时更精确地定义介电特征，例如通孔和 焊锡停止。 该方法使用可以与下面的导体共烧的电介质材料，优选在烧制后保持多孔。 将介电材料层（FDL）印刷在第一电路层的干燥但尚未烧结的导体的顶上，然后与导体共烧。 由于干燥但未烧结的导体的孔隙度，FDL在吸收溶剂之前，在烧制之前扩散FDL被最小化。 FDL可以打印成环形，封装底层导体的一部分以形成通孔定义环或VDR。 在FDL和导体已经共烧之后，在第一电路层上印刷相对厚的常规介电材料的覆盖层，部分地重叠烧结的VDR。 再次，电介质覆盖层的铺展最小化，这次是由于从覆盖层电介质吸收溶剂的烧制VDR的孔隙率。 然后烧制覆盖层电介质，并且在第一覆盖层顶部印刷常规电介质的第二覆盖层以实现期望的总电介质厚度。 第二覆盖层的扩展也被烧制的VDR抑制，导致与先前已知的工艺相比具有大大改善的定义的通孔。 或者，FDL可以印刷在干燥但未燃烧的导体的顶上，然后与导体共烧以形成具有显着改善的特征定义的焊料停止。 与通孔一样，由于多孔未燃烧导体抑制FDL的扩散，发生改进的定义。

公开(公告)号：US5680814A

公开(公告)日：1997-10-28

申请号：US603143

申请日：1996-02-20

申请人： Frans Peter Lautzenhiser ,  James Edward Walsh

发明人： Frans Peter Lautzenhiser ,  James Edward Walsh

IPC分类号： B41F15/44 ,  H05K3/12

CPC分类号： H05K3/1233 ,  B41F15/44 ,  H05K2203/0139

摘要： A screen printing device for screen printing a thick film ink through a screen so as to form a highly-defined thick film on a surface of a microelectronics circuit. The screen printing device achieves the above by bypassing excess ink that would otherwise accumulate ahead of the squeegee device, thereby limiting the pressure lead length ahead of the device during the screen printing process. As such, the screen is able to form an adequate seal with the surface of the substrate to prevent ink from bleeding out under the screen, i.e., between the screen and substrate. The result is a well-defined thick film on the substrate, and avoids the necessity of stopping the printing operation in order to remove ink from the lower surface of the screen. The screen printing device enables a method by which well-defined films can be readily deposited at high throughput levels, without necessitating additional procedures, equipment and techniques that might otherwise further complicate the printing process.

摘要翻译： 一种丝网印刷装置，用于通过屏幕丝网印刷厚膜油墨，以在微电子电路的表面上形成高度限定的厚膜。 丝网印刷装置通过绕过否则将积聚在刮板装置前面的多余的油墨来实现上述目的，从而在丝网印刷过程中将装置前的压力引线长度限制在前面。 因此，屏幕能够与基板的表面形成适当的密封，以防止墨在屏幕下方，即屏幕和基板之间渗出。 结果是在基板上形成了明确的厚膜，并且避免了为了从屏幕的下表面去除油墨而停止打印操作的必要性。 丝网印刷装置使得能够以高生产量水平容易地沉积明确定义的膜的方法，而不需要附加的程序，设备和技术，否则可能使打印过程复杂化。

公开(公告)号：US06202121B1

公开(公告)日：2001-03-13

申请号：US09060702

申请日：1998-04-15

申请人： James Edward Walsh ,  Benjamin Aaron Rudiak-Gould

发明人： James Edward Walsh ,  Benjamin Aaron Rudiak-Gould

IPC分类号： G06F1200

CPC分类号： G06F11/3485 ,  G06F3/0607 ,  G06F3/0632 ,  G06F3/0676 ,  G06F8/61 ,  G06F9/445

摘要： Installing files on a hard disk drive in a manner that improves program launch time. After a build of a program is completed, the program is launched and the disk activity associated with disk-intensive operations is monitored to determine the order in which file portions are read from a disk during program or command launch. This data is used to create a load sequence list, which indicates the order in which various portions of the files are read during launch. The installation disks include the files and the load sequence list. During the installation process, the installation program reads the data from the load sequence list and writes the file portions so they are stored in the order prescribed by the load sequence list in contiguous clusters on the hard disk drive. The computer can then read launch-related data from the disk in the proper order from contiguous disk clusters, which minimizes or eliminates wasted time that would result from disk accesses if the disk heads had to move between non-contiguous clusters in order to read the launch-related data.

摘要翻译： 以改善程序启动时间的方式在硬盘驱动器上安装文件。 程序构建完成后，启动程序，并监视与磁盘密集型操作相关联的磁盘活动，以确定在程序或命令启动期间从磁盘读取文件部分的顺序。 该数据用于创建一个加载顺序列表，该列表指示在启动期间读取文件的各个部分的顺序。 安装磁盘包括文件和加载顺序列表。 在安装过程中，安装程序从装载顺序列表中读取数据，并写入文件部分，使其按照硬盘驱动器上连续集群中的加载顺序列表规定的顺序进行存储。 然后，计算机可以从连续的磁盘集群按适当顺序从磁盘读取与启动有关的数据，这样可以最大限度地减少或消除磁盘访问造成的浪费时间，如果磁盘头不得不在不连续的集群之间移动，以便读取 发射相关数据。

公开(公告)号：US06553429B1

公开(公告)日：2003-04-22

申请号：US09092257

申请日：1998-06-05

申请人： Brian D. Wentz ,  James Edward Walsh

发明人： Brian D. Wentz ,  James Edward Walsh

IPC分类号： G06F946

CPC分类号： G06F9/4486

摘要： A conditional thunk utility employing an assembler-level direct-branch thunk technique. In a condition-check alternative, the conditional thunk utility performs a condition check followed by a direct-branch jump. The condition-check methodology is implemented using an assembler-level direct-branch technique, and the conditional thunk utility does not utilize the stack to queue the arguments of a function call. Thus, the stack is not altered from its desired condition just prior to executing the API function call. The condition-check alternative checks the thunk condition for each function call and, for this reason, may be used when the thunk condition can vary relatively frequently while the host computer system is running. In a jump-table alternative, the conditional thunk utility performs an assembler-level jump table check followed by a direct jump to a target address. In the jump-table alternative, the assembler-level direct branch code is configured to retrieve the jump address for the conditional thunk decision from the instruction cache memory (I-cache). Because the thunk conditions are checked and the jump table is configured in advance, the jump-table embodiment does not require a thunk condition check before each jump. For this reason, the jump-table alternative may be used for thunk conditions are invariant, or vary relatively infrequently, while the host computer system is running.

摘要翻译： 一种使用汇编级直接支路技术的条件thunk实用程序。 在条件检查替代方案中，条件thunk实用程序执行条件检查，然后进行直接分支跳转。 条件检查方法是使用汇编级直接分支技术实现的，条件thunk实用程序不使用堆栈对函数调用的参数进行排队。 因此，在执行API函数调用之前，堆栈不会从其所需的状态改变。 条件检查替代方法检查每个函数调用的thunk条件，并且因此，当主计算机系统运行时，thunk条件可能相对频繁地变化时可以使用。 在跳转表中，条件thunk实用程序执行汇编级跳转表检查，然后直接跳转到目标地址。 在跳转表替代中，组装级直接分支代码被配置为从指令高速缓冲存储器（I-cache）中检索条件thunk判定的跳转地址。 由于检查了thunk条件并且预先配置了跳转表，因此跳转表实施例在每次跳转之前不需要thunk状态检查。 因此，当主计算机系统运行时，跳转表替代方案可用于不稳定的thunk条件，或者相对较少变化。