公开(公告)号：US20130049766A1

公开(公告)日：2013-02-28

申请号：US13222101

申请日：2011-08-31

申请人： Franz Schoenberger ,  Johann Koelz ,  Ming Xue

发明人： Franz Schoenberger ,  Johann Koelz ,  Ming Xue

IPC分类号： G01R31/04

CPC分类号： G01R31/312 ,  G01R31/2853

摘要： A measuring device is provided: the measuring device including: a power supply configured to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a chip-carrier connected to the chip via one or more chip-to-chip-carrier connections; a detection portion including a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection; and wherein the plate is further configured such that at least part of the at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection is uncovered by the plate.

摘要翻译： 提供了一种测量装置：所述测量装置包括：电源，被配置为经由芯片连接和芯片载体连接中的至少一个向芯片提供电力; 芯片布置接收部分，被配置为接收芯片布置，所述芯片装置包括通过一个或多个芯片到芯片载体连接与芯片连接的芯片和芯片载体; 包括板的检测部分; 检测电路，其耦合到所述板并且被配置为检测来自所述板的电信号; 其中所述板被配置为使得其覆盖所述芯片，所述芯片载体和所述芯片到芯片 - 载波连接中的至少一个的至少一部分; 并且其中所述板被进一步配置为使得所述芯片，所述芯片载体和所述芯片到芯片 - 载体连接中的至少一个中的至少一个未被所述板覆盖。

公开(公告)号：US08896320B2

公开(公告)日：2014-11-25

申请号：US13222101

申请日：2011-08-31

申请人： Franz Schoenberger ,  Johann Koelz ,  Ming Xue

发明人： Franz Schoenberger ,  Johann Koelz ,  Ming Xue

IPC分类号： G01R31/04 ,  G01R31/312 ,  G01R31/28

CPC分类号： G01R31/312 ,  G01R31/2853

摘要： A measuring device is provided: the measuring device including: a power supply configured to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a chip-carrier connected to the chip via one or more chip-to-chip-carrier connections; a detection portion including a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection; and wherein the plate is further configured such that at least part of the at least one of the chip, the chip-carrier, and the chip-to-chip-carrier connection is uncovered by the plate.

摘要翻译： 提供了一种测量装置：所述测量装置包括：电源，被配置为经由芯片连接和芯片载体连接中的至少一个向芯片提供电力; 芯片布置接收部分，被配置为接收芯片布置，所述芯片装置包括通过一个或多个芯片到芯片载体连接与芯片连接的芯片和芯片载体; 包括板的检测部分; 检测电路，其耦合到所述板并且被配置为检测来自所述板的电信号; 其中所述板被配置为使得其覆盖所述芯片，所述芯片载体和所述芯片到芯片 - 载波连接中的至少一个的至少一部分; 并且其中所述板被进一步配置为使得所述芯片，所述芯片载体和所述芯片到芯片 - 载体连接中的至少一个中的至少一个未被所述板覆盖。