公开(公告)号：US20080291601A1

公开(公告)日：2008-11-27

申请号：US12092608

申请日：2006-11-02

申请人： Freddy Roozeboom ,  Johan H. Klootwijk ,  Antonius L.A.M. Kemmeren ,  Derk Reefman ,  Johannes F.C.M. Verhoeven

发明人： Freddy Roozeboom ,  Johan H. Klootwijk ,  Antonius L.A.M. Kemmeren ,  Derk Reefman ,  Johannes F.C.M. Verhoeven

IPC分类号： H01G4/228

CPC分类号： H01L28/91 ,  H01L27/0805 ,  H01L27/1087 ,  H01L29/945

摘要： The present invention relates to an electronic device (300) comprising at least one trench capacitor (302) that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence (308) of at least two dielectric layers (312, 316) and at least two electrically conductive layers (314, 318) is provided in the trench capacitor or on the pillar capacitor, such that the at least two electrically conductive layers are electrically isolated from each other and from the substrate by respective ones of the at least two dielectric layers. A set of internal contact pads (332, 334, 340) is provided, and each internal contact pad is connected with a respective one of the electrically conductive layers or with the substrate. By providing an individual internal contact pad for each of the electrically conductive layers, a range of switching opportunities is opened up that allows tuning the specific capacitance of the capacitor to a desired value. The electronic device of the invention thus provides a flexible trench-capacitor manufacturing platform for a multitude of combinations of electrically conductive layers with each other, or, when multiple trenches are used, between electrically conductive layers of different trench capacitors. On-chip applications such as a charge-pump circuit or a DC-to-DC voltage converter are claimed that benefit from the ultra-high capacitance density and the high breakdown voltage that can be achieved with the electronic device of the invention.

摘要翻译： 电子设备技术领域本发明涉及一种电子设备（300），其包括至少一个也可采取反向结构形式的沟槽电容器（302），立柱电容器。 至少两个电介质层（312,316）和至少两个导电层（314,318）的交替层序列（308）设置在沟槽电容器或柱状电容器中，使得至少两个导电 层通过至少两个电介质层中的相应电极彼此电隔离并且与衬底电隔离。 提供一组内部接触焊盘（332,334,340），并且每个内部接触焊盘与相应的一个导电层或基板连接。 通过为每个导电层提供单独的内部接触焊盘，开启一定范围的切换机会，允许将电容器的比电容调谐到期望值。 因此，本发明的电子器件为不同沟槽电容器的导电层之间的导电层的多种组合，或者当使用多个沟槽时提供柔性的沟槽电容器制造平台。 要求使用诸如电荷泵电路或DC-DC电压转换器的片上应用，其受益于本发明的电子器件可实现的超高电容密度和高击穿电压。