Semiconductor device and manufacturing method thereof
    2.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08975181B2

    公开(公告)日:2015-03-10

    申请号:US13398837

    申请日:2012-02-16

    申请人: Fenglian Li

    发明人: Fenglian Li

    IPC分类号: H01L21/44 H01L29/66 H01L29/78

    摘要: A semiconductor device and manufacture method thereof include a silicide material formed on a source region and a drain region on opposite sides of a gate, wherein the gate having sidewalls on both side surfaces is formed on a substrate. The gate has a first sidewall spacer and a second sidewall spacer on each sidewall, the first spacer has a horizontal portion and a vertical portion, the horizontal portion is located between the second sidewall spacer and the substrate, the vertical portion is located between the second sidewall spacer and the sidewalls. A protecting layer is selectively deposited on the silicide material.

    摘要翻译: 半导体器件及其制造方法包括在栅极的相对侧的源极区域和漏极区域上形成的硅化物材料,其中在两个侧面上具有侧壁的栅极形成在基板上。 栅极在每个侧壁上具有第一侧壁间隔件和第二侧壁间隔件,第一间隔件具有水平部分和垂直部分,水平部分位于第二侧壁间隔件和基板之间,垂直部分位于第二侧壁间隔件之间 侧壁间隔件和侧壁。 保护层被选择性地沉积在硅化物材料上。