公开(公告)号：US20220204831A1

公开(公告)日：2022-06-30

申请号：US17695201

申请日：2022-03-15

申请人： Fuji Polymer Industries Co., Ltd. ,  Sulfur Chemical Laboratory Inc.

发明人： Tomoyuki OKUMURA ,  Keisuke KAWAHAMA ,  Kunio MORI

IPC分类号： C09K5/14 ,  C08G77/20 ,  C08G77/08 ,  C08K9/04 ,  C08J5/18

摘要： A composition of the present invention contains the following components A to C: A. a linear terminal-reactive polydimethylsiloxane; B. a thermally conductive filler including the following B1, B2, and B3 in an amount of 800 to 2500 parts by mass with respect to 100 parts by mass of the component A; and C. a curing catalyst in a catalytic amount. The component B includes the following: B1. a thermally conductive filler that has an average particle size of 0.1 to 1.0 μm and is surface treated with a surface treatment agent containing a reactive group having no unsaturated bond; B2. a thermally conductive filler that has an average particle size of 1.0 to 10 μm and is surface treated with a surface treatment agent containing a reactive group having an unsaturated bond; and B3. a thermally conductive filler that has an average particle size of 10 to 100 μm and is surface treated with the surface treatment agent containing a reactive group having no unsaturated bond or the surface treatment agent containing a reactive group having an unsaturated bond. Thus, the thermally conductive silicone composition and the sheet formed by using this composition have a high strength.